Patents Assigned to Hemlock Semiconductor Corporation
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Patent number: 10431447Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.Type: GrantFiled: September 3, 2015Date of Patent: October 1, 2019Assignee: HEMLOCK SEMICONDUCTOR CORPORATIONInventors: Jason L. Giardina, James C. Mundell, Nathaniel C. McIntee-Chmielewski
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Patent number: 9687876Abstract: A method of forming a heterogeneous protective layer on a surface of a component in a reactor is useful for repair and/or protection. The reactor may be used for production of polycrystalline silicon or a reactant thereof. The heterogeneous protective layer comprises silicon, and may comprise silicon carbide (SiC) and/or silicon nitride (Si3N4). The method comprises providing a polymeric composition for forming the heterogeneous protective layer. The polymeric composition may comprise a polycarbosilane and/or a polysilazane. The method further comprises providing the component. The surface of the component comprises carbon, such as graphite, carbon fiber reinforced carbon, or a combination thereof. The method further comprises applying the polymeric composition on the surface to form a pre-cured coating layer. The method further comprises heating the pre-cured coating layer to form the heterogeneous protective layer.Type: GrantFiled: January 28, 2013Date of Patent: June 27, 2017Assignee: HEMLOCK SEMICONDUCTOR CORPORATIONInventor: Brad Jason Werner
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Patent number: 9261464Abstract: Provided are photoluminescence spectroscopy systems and methods for identifying and quantifying impurities in a semiconductor sample. In some embodiments, the systems and methods comprise a defocused collimated laser beam illuminating a first sample surface, and collection by a collection lens of photoluminescence from a sample edge at the intersection of the first surface with a substantially orthogonal second surface, wherein the first sample surface is oriented from about 0° to 90° with respect to a position parallel to the collection lens.Type: GrantFiled: June 3, 2011Date of Patent: February 16, 2016Assignee: Hemlock Semiconductor CorporationInventors: Doug Kreszowski, John W. Hadd
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Patent number: 9079145Abstract: A dome valve selectively dispenses a silicon product from a chamber of a vessel. The dome valve comprises a valve body defining a pass-through channel in communication with the chamber of the vessel to allow the silicon product to exit the vessel. The dome valve also comprising a valve seat defining an opening through which the silicon product enters the pass-through channel. The dome valve further comprising a domed body having a semi-hemispherical configuration. The domed body has a sealing surface. The domed body is rotatable between a closed position and an open position for allowing the selective dispensing of the silicon product from the vessel.Type: GrantFiled: June 14, 2012Date of Patent: July 14, 2015Assignee: HEMLOCK SEMICONDUCTOR CORPORATIONInventors: Don Baranowski, Matthew Bishop, Max Dehtiar, Michael John Molnar, P. Christian Naberhaus
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Patent number: 8951352Abstract: A manufacturing apparatus and an electrode for use with the manufacturing apparatus are provided for deposition of a material on a carrier body. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. An exterior coating is disposed on the exterior surface of the electrode, outside of the contact region. The exterior coating has an electrical conductivity of at least 9×106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.Type: GrantFiled: April 13, 2009Date of Patent: February 10, 2015Assignee: Hemlock Semiconductor CorporationInventors: David Hillabrand, Theodore Knapp
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Publication number: 20140348712Abstract: A dome valve selectively dispenses a silicon product from a chamber of a vessel. The dome valve comprises a valve body defining a pass-through channel in communication with the chamber of the vessel to allow the silicon product to exit the vessel. The dome valve also comprising a valve seat defining an opening through which the silicon product enters the pass-through channel. The dome valve further comprising a domed body having a semi-hemispherical configuration. The domed body has a sealing surface. The domed body is rotatable between a closed position and an open position for allowing the selective dispensing of the silicon product from the vessel.Type: ApplicationFiled: June 14, 2012Publication date: November 27, 2014Applicant: HEMLOCK SEMICONDUCTOR CORPORATIONInventors: Don Baranowski, Matthew Bishop, Max Dehtiar, Michael John Molnar, P. Christian Naberhaus
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Patent number: 8895324Abstract: A method of determining an amount of impurities that a contaminating material contributes to high purity silicon including the step of partially encasing a sample of high purity silicon in the contaminating material. The sample encased in the contaminating material is heated within a furnace. A change in impurity content of the high purity silicon is determined after the step of heating, compared to an impurity content of the high purity silicon prior to the step of heating. A furnace for heat treating high purity silicon including a housing that defines a heating chamber. The housing is at least partially formed from low contaminant material that contributes less than 400 parts per trillion of impurities to the high purity silicon during heating at annealing temperatures for a sufficient period time to anneal the high purity silicon, and the furnace contributes an average of less than 400 parts per trillion of impurities to the high purity silicon under the same heating conditions.Type: GrantFiled: April 10, 2012Date of Patent: November 25, 2014Assignee: Hemlock Semiconductor CorporationInventors: Dennis DePesa, Jon Host, Troy Houthoofd, Alan Rytlewski
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Publication number: 20140220347Abstract: An electrode composition comprises a silicon powder comprising non-crystalline and crystalline silicon, where the crystalline silicon is present in the silicon powder at a concentration of no more than about 20 wt. %. An electrode for an electrochemical cell comprises an electrochemically active material comprising non-crystalline silicon and crystalline silicon, where the non-crystalline silicon and the crystalline silicon are present prior to cycling of the electrode. A method of controlling the crystallinity of a silicon powder includes heating a reactor to a temperature of no more than 650° C. and flowing a feed gas comprising silane and a carrier gas into the reactor while maintaining an internal reactor pressure of about 2 atm or less. The silane decomposes to form a silicon powder having a controlled crystallinity and comprising non-crystalline silicon.Type: ApplicationFiled: August 14, 2012Publication date: August 7, 2014Applicants: Dow Corning Corporation, Hemlock Semiconductor Corporation, Dow Corning Toray Co., Ltd.Inventors: Max Dehtiar, Paul Fisher, Matthew A. Gave, William Herron, Takakazu Hino, Byung K. Hwang, Jennifer Larimer, Jeong Yong Lee, Joel P. McDonald, Mark Schrauben, Raymond Tabler
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Patent number: 8784565Abstract: The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. A contact region coating is disposed on the contact region of the exterior surface of the electrode. The contact region coating has an electrical conductivity of at least 9×106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.Type: GrantFiled: April 13, 2009Date of Patent: July 22, 2014Assignee: Hemlock Semiconductor CorporationInventors: David Hillabrand, Theodore Knapp
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Publication number: 20140165909Abstract: A gasket is used in a manufacturing apparatus, which deposits a material on a carrier body. A reaction chamber is defined by a housing and a base plate of the manufacturing apparatus. The gasket is disposed between the housing and the base plate for preventing a deposition composition, which comprises the material to be deposited or a precursor thereof, from escaping the reaction chamber. The gasket comprised a flexible graphite material for preventing the gasket from contaminating the material within said reaction chamber.Type: ApplicationFiled: July 20, 2011Publication date: June 19, 2014Applicant: Hemlock Semiconductor CorporationInventors: Michael L. Anderson, Stephen Trombley
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Patent number: 8609058Abstract: A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor.Type: GrantFiled: March 21, 2011Date of Patent: December 17, 2013Assignee: Hemlock Semiconductor CorporationInventors: Arvid Neil Arvidson, Michael Molnar
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Publication number: 20130075627Abstract: Provided are photoluminescence spectroscopy systems and methods for identifying and quantifying impurities in a semiconductor sample. In some embodiments, the systems and methods comprise a defocused collimated laser beam illuminating a first sample surface, and collection by a collection lens of photoluminescence from a sample edge at the intersection of the first surface with a substantially orthogonal second surface, wherein the first sample surface is oriented from about 0° to 90° with respect to a position parallel to the collection lens.Type: ApplicationFiled: June 3, 2011Publication date: March 28, 2013Applicant: HEMLOCK SEMICONDUCTOR CORPORATIONInventors: Doug Kreszowski, John W. Hadd
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Publication number: 20120070362Abstract: A method for quantitatively monitoring gas phase materials in a chemical process is provided and includes, providing a gaseous feed stream containing one or more reactant gases of interest; exposing the gaseous feed stream to coherent radiation from a Raman spectroscopic device; acquiring a Raman spectroscopic signal from each of the gaseous components in the feed stream; analyzing the spectroscopic signal to determine the presence and concentration of each of the gaseous components; and displaying the results of the analysis. In one embodiment, the method is useful for quantitatively monitoring gas phase materials in a process for making high purity silicon.Type: ApplicationFiled: May 11, 2010Publication date: March 22, 2012Applicants: HEMLOCK SEMICONDUCTOR CORPORATION, DOW CORNING CORPORATIONInventors: Greg Harms, Douglas Kreszowski, David Licht, Elmer Lipp, Michael Molnar, Marc Pinet
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Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods
Patent number: 8021483Abstract: A method for recharging a crucible with polycrystalline silicon comprises adding flowable chips to a crucible used in a Czochralski-type process. Flowable chips are polycrystalline silicon particles made from polycrystalline silicon prepared by a chemical vapor deposition process, and flowable chips have a controlled particle size distribution, generally nonspherical morphology, low levels of bulk impurities, and low levels of surface impurities. Flowable chips can be added to the crucible using conventional feeder equipment, such as vibration feeder systems and canister feeder systems.Type: GrantFiled: November 14, 2002Date of Patent: September 20, 2011Assignee: Hemlock Semiconductor CorporationInventors: Arvid Neil Arvidson, Terence Lee Horstman, Michael John Molnar, Chris Tim Schmidt, Roger Dale Spencer, Jr. -
Patent number: 7935327Abstract: A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor.Type: GrantFiled: August 30, 2006Date of Patent: May 3, 2011Assignee: Hemlock Semiconductor CorporationInventors: Arvid Neil Arvidson, Michael Molnar
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Patent number: 7927984Abstract: Silicon deposits are suppressed at the wall of a fluidized bed reactor by a process in which an etching gas is fed near the wall of the reactor. The etching gas includes tetrachlorosilane. A Siemens reactor may be integrated into the process such that the vent gas from the Siemens reactor is used to form a feed gas and/or etching gas fed to the fluidized bed reactor.Type: GrantFiled: November 5, 2008Date of Patent: April 19, 2011Assignee: Hemlock Semiconductor CorporationInventor: Michael John Molnar
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Patent number: 7080742Abstract: A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process; (2) fracturing the polycrystalline silicon workpiece into a mixture of polycrystalline silicon pieces, where the polycrystalline silicon pieces have varying sizes; and (3) sorting the mixture of polycrystalline silicon pieces into at least two size distributions. Step (2) may be carried out by a thermal shock process. Step (3) may be carried out using a rotary indent classifier.Type: GrantFiled: March 9, 2004Date of Patent: July 25, 2006Assignee: Hemlock Semiconductor CorporationInventors: Arvid Neil Arvidson, Todd Stanley Graham, Kathryn Elizabeth Messner, Chris Tim Schmidt, Terence Lee Horstman
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Patent number: 6605149Abstract: A process forms a single crystal silicon ingot from varying sized pieces of polycrystalline silicon source material according to the Czochralski method. The process comprises placing into a crucible on the bottom a generally polygonal-shaped concentric array of rod-shaped polycrystalline silicon pieces having obliquely cut ends. The method of stacking the polycrystalline silicon pieces in the crucible allows for a denser packing of silicon in the crucible, can be accomplished in a quicker time then conventional packing methods, and has the potential for less damage to the crucible bottom, when comparing to standard packing methods using a size assortment of irregular shaped silicon pieces.Type: GrantFiled: January 11, 2002Date of Patent: August 12, 2003Assignee: Hemlock Semiconductor CorporationInventor: Arvid Neil Arvidson
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Patent number: 6251182Abstract: The present invention is an improved susceptor for a float-zone apparatus for the float-zone processing of silicon elements. The susceptor is of a cylindrical design which allows the susceptor to be positioned around a free end of a silicon element to heat the free end of the silicon element to facilitate inductive coupling of the free end of the silicon element with an RF induction coil heater. In a preferred embodiment of the present invention, the susceptor is formed from tantalum.Type: GrantFiled: May 11, 1993Date of Patent: June 26, 2001Assignee: Hemlock Semiconductor CorporationInventors: Joaquin Enrique Luna, Scott Allen Wheelock
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Patent number: 5906799Abstract: The present invention is a reactor for the hydrogenation of chlorosilanes at temperatures above about 600.degree. C. The reactor comprises one or more of the following improvements: (1) a reaction chamber formed from a silicon carbide coated carbon fiber composite, (2) a heating element formed from a silicon carbide coated carbon fiber composite, and (3) one or more silicon nitride insulators electrically insulating the heating element.Type: GrantFiled: June 1, 1992Date of Patent: May 25, 1999Assignee: Hemlock Semiconductor CorporationInventors: Richard Anthony Burgie, Eric Michael Fleming