Patents Assigned to Hemlock Semiconductor Corporation
  • Patent number: 10431447
    Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: October 1, 2019
    Assignee: HEMLOCK SEMICONDUCTOR CORPORATION
    Inventors: Jason L. Giardina, James C. Mundell, Nathaniel C. McIntee-Chmielewski
  • Patent number: 9687876
    Abstract: A method of forming a heterogeneous protective layer on a surface of a component in a reactor is useful for repair and/or protection. The reactor may be used for production of polycrystalline silicon or a reactant thereof. The heterogeneous protective layer comprises silicon, and may comprise silicon carbide (SiC) and/or silicon nitride (Si3N4). The method comprises providing a polymeric composition for forming the heterogeneous protective layer. The polymeric composition may comprise a polycarbosilane and/or a polysilazane. The method further comprises providing the component. The surface of the component comprises carbon, such as graphite, carbon fiber reinforced carbon, or a combination thereof. The method further comprises applying the polymeric composition on the surface to form a pre-cured coating layer. The method further comprises heating the pre-cured coating layer to form the heterogeneous protective layer.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: June 27, 2017
    Assignee: HEMLOCK SEMICONDUCTOR CORPORATION
    Inventor: Brad Jason Werner
  • Patent number: 9261464
    Abstract: Provided are photoluminescence spectroscopy systems and methods for identifying and quantifying impurities in a semiconductor sample. In some embodiments, the systems and methods comprise a defocused collimated laser beam illuminating a first sample surface, and collection by a collection lens of photoluminescence from a sample edge at the intersection of the first surface with a substantially orthogonal second surface, wherein the first sample surface is oriented from about 0° to 90° with respect to a position parallel to the collection lens.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: February 16, 2016
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Doug Kreszowski, John W. Hadd
  • Patent number: 9079145
    Abstract: A dome valve selectively dispenses a silicon product from a chamber of a vessel. The dome valve comprises a valve body defining a pass-through channel in communication with the chamber of the vessel to allow the silicon product to exit the vessel. The dome valve also comprising a valve seat defining an opening through which the silicon product enters the pass-through channel. The dome valve further comprising a domed body having a semi-hemispherical configuration. The domed body has a sealing surface. The domed body is rotatable between a closed position and an open position for allowing the selective dispensing of the silicon product from the vessel.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: July 14, 2015
    Assignee: HEMLOCK SEMICONDUCTOR CORPORATION
    Inventors: Don Baranowski, Matthew Bishop, Max Dehtiar, Michael John Molnar, P. Christian Naberhaus
  • Patent number: 8951352
    Abstract: A manufacturing apparatus and an electrode for use with the manufacturing apparatus are provided for deposition of a material on a carrier body. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. An exterior coating is disposed on the exterior surface of the electrode, outside of the contact region. The exterior coating has an electrical conductivity of at least 9×106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: February 10, 2015
    Assignee: Hemlock Semiconductor Corporation
    Inventors: David Hillabrand, Theodore Knapp
  • Publication number: 20140348712
    Abstract: A dome valve selectively dispenses a silicon product from a chamber of a vessel. The dome valve comprises a valve body defining a pass-through channel in communication with the chamber of the vessel to allow the silicon product to exit the vessel. The dome valve also comprising a valve seat defining an opening through which the silicon product enters the pass-through channel. The dome valve further comprising a domed body having a semi-hemispherical configuration. The domed body has a sealing surface. The domed body is rotatable between a closed position and an open position for allowing the selective dispensing of the silicon product from the vessel.
    Type: Application
    Filed: June 14, 2012
    Publication date: November 27, 2014
    Applicant: HEMLOCK SEMICONDUCTOR CORPORATION
    Inventors: Don Baranowski, Matthew Bishop, Max Dehtiar, Michael John Molnar, P. Christian Naberhaus
  • Patent number: 8895324
    Abstract: A method of determining an amount of impurities that a contaminating material contributes to high purity silicon including the step of partially encasing a sample of high purity silicon in the contaminating material. The sample encased in the contaminating material is heated within a furnace. A change in impurity content of the high purity silicon is determined after the step of heating, compared to an impurity content of the high purity silicon prior to the step of heating. A furnace for heat treating high purity silicon including a housing that defines a heating chamber. The housing is at least partially formed from low contaminant material that contributes less than 400 parts per trillion of impurities to the high purity silicon during heating at annealing temperatures for a sufficient period time to anneal the high purity silicon, and the furnace contributes an average of less than 400 parts per trillion of impurities to the high purity silicon under the same heating conditions.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: November 25, 2014
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Dennis DePesa, Jon Host, Troy Houthoofd, Alan Rytlewski
  • Publication number: 20140220347
    Abstract: An electrode composition comprises a silicon powder comprising non-crystalline and crystalline silicon, where the crystalline silicon is present in the silicon powder at a concentration of no more than about 20 wt. %. An electrode for an electrochemical cell comprises an electrochemically active material comprising non-crystalline silicon and crystalline silicon, where the non-crystalline silicon and the crystalline silicon are present prior to cycling of the electrode. A method of controlling the crystallinity of a silicon powder includes heating a reactor to a temperature of no more than 650° C. and flowing a feed gas comprising silane and a carrier gas into the reactor while maintaining an internal reactor pressure of about 2 atm or less. The silane decomposes to form a silicon powder having a controlled crystallinity and comprising non-crystalline silicon.
    Type: Application
    Filed: August 14, 2012
    Publication date: August 7, 2014
    Applicants: Dow Corning Corporation, Hemlock Semiconductor Corporation, Dow Corning Toray Co., Ltd.
    Inventors: Max Dehtiar, Paul Fisher, Matthew A. Gave, William Herron, Takakazu Hino, Byung K. Hwang, Jennifer Larimer, Jeong Yong Lee, Joel P. McDonald, Mark Schrauben, Raymond Tabler
  • Patent number: 8784565
    Abstract: The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. A contact region coating is disposed on the contact region of the exterior surface of the electrode. The contact region coating has an electrical conductivity of at least 9×106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: July 22, 2014
    Assignee: Hemlock Semiconductor Corporation
    Inventors: David Hillabrand, Theodore Knapp
  • Publication number: 20140165909
    Abstract: A gasket is used in a manufacturing apparatus, which deposits a material on a carrier body. A reaction chamber is defined by a housing and a base plate of the manufacturing apparatus. The gasket is disposed between the housing and the base plate for preventing a deposition composition, which comprises the material to be deposited or a precursor thereof, from escaping the reaction chamber. The gasket comprised a flexible graphite material for preventing the gasket from contaminating the material within said reaction chamber.
    Type: Application
    Filed: July 20, 2011
    Publication date: June 19, 2014
    Applicant: Hemlock Semiconductor Corporation
    Inventors: Michael L. Anderson, Stephen Trombley
  • Patent number: 8609058
    Abstract: A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 17, 2013
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Arvid Neil Arvidson, Michael Molnar
  • Publication number: 20130075627
    Abstract: Provided are photoluminescence spectroscopy systems and methods for identifying and quantifying impurities in a semiconductor sample. In some embodiments, the systems and methods comprise a defocused collimated laser beam illuminating a first sample surface, and collection by a collection lens of photoluminescence from a sample edge at the intersection of the first surface with a substantially orthogonal second surface, wherein the first sample surface is oriented from about 0° to 90° with respect to a position parallel to the collection lens.
    Type: Application
    Filed: June 3, 2011
    Publication date: March 28, 2013
    Applicant: HEMLOCK SEMICONDUCTOR CORPORATION
    Inventors: Doug Kreszowski, John W. Hadd
  • Publication number: 20120070362
    Abstract: A method for quantitatively monitoring gas phase materials in a chemical process is provided and includes, providing a gaseous feed stream containing one or more reactant gases of interest; exposing the gaseous feed stream to coherent radiation from a Raman spectroscopic device; acquiring a Raman spectroscopic signal from each of the gaseous components in the feed stream; analyzing the spectroscopic signal to determine the presence and concentration of each of the gaseous components; and displaying the results of the analysis. In one embodiment, the method is useful for quantitatively monitoring gas phase materials in a process for making high purity silicon.
    Type: Application
    Filed: May 11, 2010
    Publication date: March 22, 2012
    Applicants: HEMLOCK SEMICONDUCTOR CORPORATION, DOW CORNING CORPORATION
    Inventors: Greg Harms, Douglas Kreszowski, David Licht, Elmer Lipp, Michael Molnar, Marc Pinet
  • Patent number: 8021483
    Abstract: A method for recharging a crucible with polycrystalline silicon comprises adding flowable chips to a crucible used in a Czochralski-type process. Flowable chips are polycrystalline silicon particles made from polycrystalline silicon prepared by a chemical vapor deposition process, and flowable chips have a controlled particle size distribution, generally nonspherical morphology, low levels of bulk impurities, and low levels of surface impurities. Flowable chips can be added to the crucible using conventional feeder equipment, such as vibration feeder systems and canister feeder systems.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: September 20, 2011
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Arvid Neil Arvidson, Terence Lee Horstman, Michael John Molnar, Chris Tim Schmidt, Roger Dale Spencer, Jr.
  • Patent number: 7935327
    Abstract: A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: May 3, 2011
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Arvid Neil Arvidson, Michael Molnar
  • Patent number: 7927984
    Abstract: Silicon deposits are suppressed at the wall of a fluidized bed reactor by a process in which an etching gas is fed near the wall of the reactor. The etching gas includes tetrachlorosilane. A Siemens reactor may be integrated into the process such that the vent gas from the Siemens reactor is used to form a feed gas and/or etching gas fed to the fluidized bed reactor.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: April 19, 2011
    Assignee: Hemlock Semiconductor Corporation
    Inventor: Michael John Molnar
  • Patent number: 7080742
    Abstract: A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process; (2) fracturing the polycrystalline silicon workpiece into a mixture of polycrystalline silicon pieces, where the polycrystalline silicon pieces have varying sizes; and (3) sorting the mixture of polycrystalline silicon pieces into at least two size distributions. Step (2) may be carried out by a thermal shock process. Step (3) may be carried out using a rotary indent classifier.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: July 25, 2006
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Arvid Neil Arvidson, Todd Stanley Graham, Kathryn Elizabeth Messner, Chris Tim Schmidt, Terence Lee Horstman
  • Patent number: 6605149
    Abstract: A process forms a single crystal silicon ingot from varying sized pieces of polycrystalline silicon source material according to the Czochralski method. The process comprises placing into a crucible on the bottom a generally polygonal-shaped concentric array of rod-shaped polycrystalline silicon pieces having obliquely cut ends. The method of stacking the polycrystalline silicon pieces in the crucible allows for a denser packing of silicon in the crucible, can be accomplished in a quicker time then conventional packing methods, and has the potential for less damage to the crucible bottom, when comparing to standard packing methods using a size assortment of irregular shaped silicon pieces.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: August 12, 2003
    Assignee: Hemlock Semiconductor Corporation
    Inventor: Arvid Neil Arvidson
  • Patent number: 6251182
    Abstract: The present invention is an improved susceptor for a float-zone apparatus for the float-zone processing of silicon elements. The susceptor is of a cylindrical design which allows the susceptor to be positioned around a free end of a silicon element to heat the free end of the silicon element to facilitate inductive coupling of the free end of the silicon element with an RF induction coil heater. In a preferred embodiment of the present invention, the susceptor is formed from tantalum.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: June 26, 2001
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Joaquin Enrique Luna, Scott Allen Wheelock
  • Patent number: 5906799
    Abstract: The present invention is a reactor for the hydrogenation of chlorosilanes at temperatures above about 600.degree. C. The reactor comprises one or more of the following improvements: (1) a reaction chamber formed from a silicon carbide coated carbon fiber composite, (2) a heating element formed from a silicon carbide coated carbon fiber composite, and (3) one or more silicon nitride insulators electrically insulating the heating element.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: May 25, 1999
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Richard Anthony Burgie, Eric Michael Fleming