Patents Assigned to Henkel (China) Company Limited
  • Method for bonding substrates using a UV radiation curing-redox curing adhesive system
    Patent number: 9039852
    Abstract: The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: May 26, 2015
    Assignees: Henkel IP & Holding GmbH, Henkel (China) Company Limited
    Inventors: Shabbir Attarwala, Nicolas Zhou, Yinxiao Yuan, Daoqiang Lu, Chongjian Song
  • Silicone resin with improved barrier properties
    Patent number: 8759468
    Abstract: The moisture and gas barrier properties of an organopolysiloxane having at least two substituents which are able to undergo crosslinking reactions per molecule shall be improved. This is achieved by providing an organopolysiloxane wherein at least 10 mol % of all substituents are represented by formula (1) wherein q is an integer from 0 to 5 and R1, R2, R3 each independently are methyl or ethyl groups. Furthermore, the invention is directed to a composition based on the aforementioned organopolysiloxane and to the use of the organopolysiloxane and of the composition.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel (China) Company Limited
    Inventors: Liwei Zhang, Yong Zhang
  • Curable resins for LED encapsulation
    Patent number: 8668991
    Abstract: The present invention relates to a curable organopolysiloxane composition, which comprises: (A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4; (B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)M.(R4R5SiO2/2)D.(R6SiO3/2)T.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 11, 2014
    Assignee: Henkel (China) Company Limited
    Inventors: Wenjuan Tan, Zhiming Pasing Li, Wentao Thomas Xing, Liwei Zhang, Yong Zhang
  • SILICONE RESIN WITH IMPROVED BARRIER PROPERTIES
    Publication number: 20130197181
    Abstract: The moisture and gas barrier properties of an organopolysiloxane having at least two substituents which are able to undergo crosslinking reactions per molecule shall be improved. This is achieved by providing an organopolysiloxane wherein at least 10 mol % of all substituents are represented by formula (1) wherein q is an integer from 0 to 5 and R1, R2, R3 each independently are methyl or ethyl groups. Furthermore, the invention is directed to a composition based on the aforementioned organopolysiloxane and to the use of the organopolysiloxane and of the composition.
    Type: Application
    Filed: March 12, 2013
    Publication date: August 1, 2013
    Applicant: Henkel (China) Company Limited
    Inventor: Henkel (China) Company Limited
  • CURABLE RESINS FOR LED ENCAPSULATION
    Publication number: 20130190446
    Abstract: The present invention relates to a curable organopolysiloxane composition, which comprises: (A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4; (B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)m.(R4R5SiO2/2)D.(R6SiO3/2)T.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Applicant: Henkel (China) Company Limited
    Inventor: Henkel (China) Company Limited