Abstract: Polyamide resins are disclosed of polymeric fat acids or certain dicarboxylic acids derived from a fatty acid and a bis(aminomethyl)tricyclodecane. Copolymerized acids or diamine or amino acids may be present. Because of the greater rigidity of some of the resins in addition to the other desirable properties of the polymeric fat acid polyamides, more application areas are opened such as the injection molded or extruded structural parts and components in addition to their utility as adhesives.
Type:
Grant
Filed:
July 18, 1984
Date of Patent:
September 2, 1986
Assignee:
Henkel Corportion
Inventors:
Edgar R. Rogier, H. Gordon Kanten, Dwight E. Peerman