Patents Assigned to HENKEL JAPAN LIMITED
  • ADHESIVE FOR ELECTRONIC COMPONENT
    Publication number: 20140242757
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicants: HENKEL IP & HOLDING GMBH, HENKEL JAPAN LIMITED
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang