Abstract: Reactive hotmelt adhesives based on liquid polyether polyols and/or polyester polyols and aromatic diols with at least one diisocyanate have a very low melt viscosity and high early strength. They are particularly suitable for the bonding of substrates of poor thermal conductivity, such as foams and nonwoven materials, and heat-sensitive substrates.
Type:
Grant
Filed:
December 3, 1996
Date of Patent:
November 30, 1999
Assignee:
Henkel Kommanditgeesellschaft auf Aktien