Patents Assigned to Henkel Ltd - Justia Patents Search

Patents Assigned to Henkel Ltd

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

Patent number: 8273606

Abstract: The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.

Type: Grant

Filed: September 17, 2010

Date of Patent: September 25, 2012

Assignees: Henkel Corporation, Henkel Ltd

Inventors: Chew B. Chan, Qing Ji, Mark Currie, Neil Poole, Geraldine Kelly