Abstract: The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than ?35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.
Type:
Application
Filed:
March 12, 2013
Publication date:
September 18, 2014
Applicants:
Henkel Ltd., Henkel Corporation
Inventors:
Richard Ellis, Geetanjaliben Shah, Andrea Eodice
Abstract: The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
Type:
Grant
Filed:
September 17, 2010
Date of Patent:
September 25, 2012
Assignees:
Henkel Corporation, Henkel Ltd
Inventors:
Chew B. Chan, Qing Ji, Mark Currie, Neil Poole, Geraldine Kelly
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