Patents Assigned to Henkel US IP LCC
  • Low application temperature hot melt adhesive
    Patent number: 8702900
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 22, 2014
    Assignee: Henkel US IP LCC
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus