Patents Assigned to Heptagon Micro Optics Pte. Ltd.
  • Patent number: 11112304
    Abstract: Calibrating a spectrometer module includes performing measurements using the spectrometer module to generate wavelength-versus-operating parameter calibration data for the spectrometer module, performing measurements using the spectrometer module to generate optical crosstalk and dark noise calibration data for the spectrometer module, and performing measurements using the spectrometer module to generate full system response calibration data, against a known reflectivity standard, for the spectrometer module. The method further includes storing in memory, coupled to the spectrometer module, a calibration record that incorporates the wavelength-versus-operating parameter calibration data, the optical crosstalk and dark noise calibration data, and the full system response calibration data, and applying the calibration record to measurements by the spectrometer module.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: September 7, 2021
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Kotaro Ishizaki, Javier Miguel-Sánchez, Peter Roentgen
  • Patent number: 11009660
    Abstract: The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 18, 2021
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Simon Gubser, Qichuan Yu, Choon Hein Law, Ji Wang
  • Patent number: 10566363
    Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 18, 2020
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
  • Patent number: 10236400
    Abstract: The present disclosure describes quantum dot film based demodulation structures and optical ranging systems including an array of QDF demodulation structures.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: March 19, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Daniel Furrer, Stephan Beer, Bernhard Buettgen
  • Patent number: 10215909
    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 26, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Simon Gubser, Frank Sobel, Alexander Bietsch, Jens Geiger
  • Publication number: 20190051762
    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
    Type: Application
    Filed: February 21, 2017
    Publication date: February 14, 2019
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
  • Patent number: 10204945
    Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: February 12, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Jukka Alasirniö, Bojan Tesanovic, Tobias Senn, Devanraj Kupusamy, Alexander Bietsch
  • Patent number: 10199426
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 10199412
    Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: February 5, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Simon Gubser, Sonja Hanselmann, Qichuan Yu, Cris Calsena, Guo Xiong Wu, Hartmut Rudmann
  • Patent number: 10193026
    Abstract: An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer layer joining the cover substrate to the base substrate. The spacer layer includes multiple first spacer elements fixed to a surface of the cover substrate and multiple second spacer elements fixed to a surface of the base substrate, in which each first spacer element is joined to a corresponding second spacer element through an adhesive layer, and in which the cover substrate, base substrate, and spacer layer define an interior region of the module in which the optical element is aligned with the optoelectronic device.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: January 29, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Susanne Westenhöfer, Simon Gubser
  • Patent number: 10190908
    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: January 29, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
  • Patent number: 10186540
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: January 22, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 10180235
    Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31?; 31??) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31?. . .
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: January 15, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Markus Rossi
  • Patent number: 10171918
    Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: January 1, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Jens Geiger, Markus Rossi, Hartmut Rudmann
  • Publication number: 20180372943
    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 27, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Simon Gubser, Frank Sobel, Alexander Bietsch, Jens Geiger
  • Patent number: 10147167
    Abstract: Generating a super-resolved reconstructed image includes acquiring a multitude of monochromatic images of a scene and extracting high-frequency band luma components from the acquired images. A high-resolution luma image is generated using the high-frequency components and motion data for the acquired images. The high-resolution luma image is combined with an up-sampled color image, generated from the acquired images, to generate a super-resolved reconstructed color image of the scene.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: December 4, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Florin Cutu, James Eilertsen
  • Patent number: 10126530
    Abstract: Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: November 13, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Simon Gubser, Hakan Karpuz
  • Patent number: 10101555
    Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 16, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Jukka Alasirnio, Hartmut Rudmann, Mario Cesana, Stephan Heimgartner
  • Publication number: 20180295453
    Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.
    Type: Application
    Filed: October 19, 2017
    Publication date: October 11, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Jens Geiger, Markus Rossi, Hartmut Rudmann
  • Patent number: 10096644
    Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: October 9, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Stephan Heimgartner, Alexander Bietsch, Hartmut Rudmann, Markus Rossi, Simon Gubser