Abstract: An optical ranging system includes a demodulation pixel array and a multi-mode light emitter. The multi-mode light emitter includes an illumination source and can generate a diffuse illumination and a discrete illumination in a first and second mode, respectively. Accordingly, in some implementations, the optical ranging system collects distance data via a time-of-flight technique and a structure-light technique. The illumination source can be operable to produce a diffuse illumination in a first mode and a discrete illumination in a second mode.

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

Abstract: Fabricating an optics wafer includes providing a wafer including a core region composed of a glass-reinforced epoxy. The wafer further includes a first resin layer on a top surface of the core region and a second resin layer on a bottom surface of the core region. The core region and first and second resin layers are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer further includes vertical transparent regions that extend through the core region and the first and second resin layers and are composed of a solid material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer is thinned, and optical structures are provided on one or more exposed surfaces of at least some of the transparent regions.

Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

Abstract: Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.

Abstract: An optoelectronic module operable to collect distance data via a time-of-flight mode and a time-of-flight-triangulation mode includes an illumination assembly and an imaging assembly. The imaging assembly includes at least one demodulation pixel operable to determine distance to an object via a time-of-flight mode and a time-of-flight-triangulation mode. Multi-path distance inaccuracies can be mitigated in some implementations.

Abstract: Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

Abstract: Opto-electronic modules include masking features that can help reduce the visibility of interior components or enhance the outer appearance of the module or of an appliance incorporating the module as a component. The modules can include an optical diode or saturable optical absorber.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract: The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.

Abstract: The present disclosure describes structured-stereo imaging assemblies including separate imagers for different wavelengths. The imaging assembly can include, for example, multiple imager sub-arrays, each of which includes a first imager to sense light of a first wavelength or range of wavelengths and a second imager to sense light of a different second wavelength or range of wavelengths. Images acquired from the imagers can be processed to obtain depth information and/or improved accuracy. Various techniques are described that can facilitate determining whether any of the imagers or sub-arrays are misaligned.

Abstract: The opto-electronic module (1) comprises —a first substrate member (P); —a third substrate member (B); —a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a?;5b;5b?); —a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); —a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); —a light detecting element (D) arranged on and electrically connected to said first substrate member (P); —a light emission element (E) arranged on and electrically connected to said first substrate member (P); —and a sensing

Abstract: Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.