Abstract: One aspect generally relates to a Cr, Ni, Mo and Co alloy, with tightly controlled levels of impurities. One aspect relates to an alloy including about 10 to about 30 weight % Cr, about 20 to about 50 weight % Ni, about 2 to about 20 weight % Mo, about 10 to about 50 weight % Co, and less than about 0.01 weight % Al, wherein each weight % is based on the total weight of the alloy.

Abstract: One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.

Abstract: The present invention relates to a process for the production of a layered body (1), at least comprising the process steps: I) provision of a photoactive layer comprising a material having a perovskite type crystal structure; II) superimposing the photoactive layer at least partially with a coating composition A) comprising an electrically conductive polymer a) and an organic solvent b); III) at least partial removal of the organic solvent b) from the coating composition A) superimposed in process step II), thereby obtaining an electrically conductive layer superimposed on the photoactive layer. The present invention also relates to a layered body obtainable by this process, to dispersions, to an electronic device, to a process for the preparation of a photovoltaic device and to the photovoltaic device that is obtainable by this process.

Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: One aspect includes a manufacturing method for a multielectrode system including providing several conductors, which are electrically conductive in their longitudinal direction; bundling the conductors at a proximal portion of the multielectrode system by means of a sheath surrounding the conductors to form a conductor bundle configured to be used as a lead of the multielectrode system; and providing several ring electrodes each surrounding one of the conductors at a distal portion of the multielectrode system and electrically connecting the ring electrodes and the conductors to form a multielectrode array of the multielectrode system. The multielectrode array is configured to be in a longitudinally extended or in a transversally expanded configuration.

Abstract: One aspect is a manufacturing method including providing at least a first electrically conductive wire with an electrical insulation and a second electrically conductive wire with an electrical insulation, providing a first and a second ring electrode surrounding the wires, electrically connecting the first ring electrode with the first wire and the second ring electrode with the second wire, bundling the ring electrodes and the wires by means of a first sheath surrounding the ring electrodes and the wires to obtain a first ring electrode component, providing a second ring electrode component, bundling the ring electrode components by means of a second sheath surrounding the ring electrode components, and partially removing the first and the second sheaths from the ring electrodes to expose ring electrode portions.

Abstract: One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.

Abstract: One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.

Abstract: The invention relates to an electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes, particularly in electrical devices, particularly in temperature sensitive electrical devices or solar cells, particularly in HIT (Heterojunction with Intrinsic Thin-layer) solar cells. In particular, the invention relates to a paste, a process for preparing a paste, a precursor, a process for preparing an electrical device and a module comprising electrical devices. The invention relates to a paste comprising the following paste constituents: a. Ag particles, b. a polymer system; wherein the Ag particles have a multi-modal distribution of particle diameter with at least a first maximum in the range from about 1 nm to about less than 1 ?m and at least a further maximum in the range from about 1 ?m to about less than 1 mm; wherein the difference between the first and the further maximum is at least about 0.3 ?m; wherein at least 50 wt.

Abstract: A process for the incineration of activated coal-supported PGM catalysts, the process comprising a joint incineration of a multilayer arrangement, wherein the multilayer arrangement includes (i) a top layer of particulate activated coal-supported PGM catalyst, (ii) a layer of coarse charcoal located beneath said top layer and, optionally, (iii) a layer of particulate coke located beneath the charcoal layer, and wherein an upward flow of oxidizing gas is homogeneously passed through said multilayer arrangement during the incineration.

Abstract: One aspect relates to a production method for a ring electrode, to a ring electrode, and to an electrode system. One method for the ring electrode includes providing an outer element, including an outer tube, providing a first inner element, including a first inner tube having a first core of a sacrificial material, providing a second inner element, including a second core of a sacrificial material, forming a composite tube by arranging the first inner element and the second inner element inside the outer element, the first inner element and the second inner element being arranged off-center with respect to one another, drawing the composite tube in a longitudinal direction of the composite tube, separating a composite tube disk from the composite tube, removing the sacrificial material of the first core, and removing the sacrificial material of the second core in order to obtain a contacting opening in the ring electrode.

Abstract: Process for producing a layer structure, which comprises the steps: E1. provision of a composition comprising i. gold (Au) particles in an amount in the range from 0.1 to 50% by weight; ii. a balance to 100% by weight of a polar, protic organic solvent; iii. less than 5% by weight of water, where the % by weight, in each case based on the total mass of the composition, add up to 100% by weight; E2. application of the composition to a substrate to give a precursor; E3. heating of the precursor to a temperature in the range from 25 to 200° C. to give the layer structure.

Abstract: Process for removing precious metal from precious metal-containing catalyst form bodies comprising form bodies and precious metal, whereby the precious metal to be removed is at least one precious metal selected from the group consisting of Au, Ag, Pd, Pt, Ir, Rh, Ru, Os, and Re, comprising the steps of: (a) producing a mixture of precious metal-containing catalyst form bodies in at least one mineral acid that is at least 1N; (b) supplying inert or oxidizing gas into the mixture containing noble metal-containing catalyst form bodies and mineral acid; (c) introducing at least one oxidation agent, in solid or liquid form, into the mixture containing noble metal-containing catalyst form body and mineral acid; and (d) separating the form bodies from the liquid.

Abstract: One aspect relates to a piezoresistive material, a detection unit having such piezoresistive material, and a method for producing such piezoresistive material. Further, several uses of the material uses of the piezoresistive material or the detection unit are described. The piezoresistive material includes a compound of a carbon component and an elastomer component. The carbon component includes carbon particles including macropores. The elastomer component includes polymeric chains. At least some of the macropores in the carbon particles are infiltrated by polymeric chains to form a piezoresistive interconnection between the carbon particles.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.

Abstract: Method for the production of tetrakis(trihydrocarbylphosphane)palladium(0) in organic solvent, whereby 50 to 100% by weight of the organic solvent consist of at least one polar-aprotic solvent, characterised in that a) at least one palladium compound selected from the group consisting of palladium(II) compounds and palladium(IV) compounds that are soluble in the organic solvent is reacted with b) at least one base, selected from the group consisting of alkali metal hydroxides, alkali metal carbonates, alkali metal hydrogen carbonates, alkali metal-C1-C4-alcoholates, ammonium carbonate, ammonium hydrogen carbonate, alkaline earth metal hydroxides, alkaline earth metal carbonates, alkaline earth metal hydrogen carbonates, alkaline earth metal-C1-C4-alcoholates, and alkylamines with a total of 2 to 12 carbon atoms; c) at least one trihydrocarbylphosphane; and d) at least one organic reducing agent that is different from the remaining components that are used in the method.