Patents Assigned to Heraeus GmbH
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Patent number: 9014816Abstract: A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.Type: GrantFiled: October 7, 2010Date of Patent: April 21, 2015Assignee: W. C. Heraeus GmbHInventors: Jacob E. Markham, John W. Warling, Victoria K. Sandberg
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Patent number: 8636825Abstract: One aspect relates to a method for producing an alloy characterized by grinding tantalum to form a tantalum powder and grinding tungsten to form a tungsten powder; mixing the tantalum powder and the tungsten powder to form a blended powder. The weight fraction of tungsten powder in the blended powder is larger than in the desired alloy. A blended body is produced from the blended powder by a powder metallurgical route. A pre-alloy is produced by a first melting of the blended body and at least a fraction of at least one further metal by a melt metallurgical route. The alloy is produced by a second melting of the pre-alloy and the remaining fraction of at least one metal by a melt metallurgical route.Type: GrantFiled: April 21, 2011Date of Patent: January 28, 2014Assignee: W. C. Heraeus GmbHInventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel, Egbert Stiedl
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Patent number: 8606370Abstract: One aspect is a medical electrode system including a conduction coil and a stimulation electrode. The stimulation electrode encompasses a base body having a top area and an end area. The system is characterized in that the conduction coil encompasses a connection element. The connection element is thermally shrink-fitted onto the end area.Type: GrantFiled: July 16, 2010Date of Patent: December 10, 2013Assignee: W. C. Heraeus GmbHInventors: Christoph Vogt, Lena Lewandrowski, Stefan Schibli, Christiane Leitold, René Richter
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Patent number: 8594808Abstract: One aspect relates to a stimulation electrode including an electrically conducting base body. The base body encompasses tantalum and is at least partially covered with a porous tantalum oxide layer, which is anodically applied by means of high voltage pulses. Provision is made according to an embodiment for a metallic protective layer to cover the porous tantalum oxide layer so as to prevent a hydrogen embrittlement.Type: GrantFiled: May 28, 2010Date of Patent: November 26, 2013Assignee: W. C. Heraeus GmbHInventors: Heiko Specht, Frank Krüger, Ulrich Hausch, Andreas Reisinger
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Patent number: 8569625Abstract: A wire includes a first wire segment having an end portion and a second wire segment having an end portion. A coupling segment is adjacent the end portions of the first and second wire segments. The coupling segment is configured with a plurality of indents penetrating into at least one of the first and second wire segments.Type: GrantFiled: December 22, 2009Date of Patent: October 29, 2013Assignee: W. C. Heraeus GmbHInventors: Todd W. Slininger, John W. Warling
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Patent number: 8528201Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal powder, metal slurry, cermet powder and/or cermet slurry into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.Type: GrantFiled: February 1, 2011Date of Patent: September 10, 2013Assignee: W. C. Heraeus GmbHInventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Nicole Guebler
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Patent number: 8512762Abstract: What is described are sporicidal compositions, in which hydrogen peroxide and at least one radical stabilizer are homogeneously dissolved in a methacrylate monomer or a mixture of methacrylate monomers, and the quantitative ratio of radical stabilizer to hydrogen peroxide is larger than or equal to 1 to 1. The sporicidal monomer/monomer mixture is usually used for producing single component bone cement pastes; two-component bone cement pastes or monomer solutions for polymethylmethacrylate bone cements that are based on cement powder and monomer liquid.Type: GrantFiled: December 17, 2009Date of Patent: August 20, 2013Assignee: Heraeus GmbHInventors: Sebastian Vogt, Hubert Büchner
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Patent number: 8494635Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, a corresponding electrical bushing, and a corresponding implantable device. The method according to one embodiment is characterized in that a green blank is produced and sintered from an electrically insulating base body green blank made of a ceramic slurry or powder and at least one electrically conductive bushing body green blank made of a cermet material. The at least one bushing body green blank is inserted into a bushing opening of the base body green blank to form a composite green blank, a shape of the at least one bushing body green blank and a shape of the at least one bushing opening are complementary to each other at least in sections thereof and prevent slippage of the bushing body green blank through the bushing opening. The composite green blank is sintered while applying a force that keeps the bodies together.Type: GrantFiled: February 1, 2011Date of Patent: July 23, 2013Assignee: W. C. Heraeus GmbHInventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Norbert Wollenberg, Nicole Guebler
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Patent number: 8414679Abstract: One aspect is a method for producing an alloy, whereby the alloy includes at least a first metal and a second metal, whereby firstly a powder metallurgical route and subsequently a melt metallurgical route is used sequentially in order to generate the alloy from the, at least, first metal and the second metal. The method includes grinding the first metal into a first metal powder, grinding the second metal into a second metal powder, mixing the first metal powder and the second metal powder to produce a blended powder, generating a blended body from the blended powder by the powder metallurgical route, and generating the alloy by melting the blended body by the melt metallurgical route.Type: GrantFiled: August 6, 2010Date of Patent: April 9, 2013Assignee: W. C. Heraeus GmbHInventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
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Patent number: 8399529Abstract: For processing of noble metal-containing, moist recycling materials with an unknown noble metal content (hereinafter called “batch”), a moisture-binding agent is added for homogenisation and the batch is mixed with comminution of optionally pre-sent agglomerates to form a free-flowing and homogenous powder. Optionally, the following takes place subsequently for analysis: A at least one representative, volume-reduced sample is taken first of all, B the sample is dried, C the sample is optionally divided further and D the sample is analyzed and the noble metal content of the batch is calculated on the basis of the data a previously known or pre-calculated quantity of the moisture-binding agent being added before sampling (step A).Type: GrantFiled: September 7, 2006Date of Patent: March 19, 2013Assignee: W.C. Heraeus GmbHInventors: Christian Mock, Horst Meyer, Matthias Grehl, Jochen Schleβmann, Martin Stettner
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Patent number: 8394170Abstract: One aspect is a method for producing an alloy, whereby the alloy consists of a first metal, a second metal, a third metal, and a fourth metal, and the first metal, the second metal, the third metal, and the fourth metal are selected from the group consisting of the metals, niobium, zirconium, tantalum tungsten. The method includes the steps of grinding the first metal to form a first metal powder and grinding the second metal to form a second metal powder; mixing the first metal powder and the second metal powder to form a first blended powder; generating a first blended body from the blended powder by a powder metallurgical route; and generating the alloy by melting the first blended body and the remaining metals by a melt metallurgical route.Type: GrantFiled: December 2, 2010Date of Patent: March 12, 2013Assignee: W. C. Heraeus GmbHInventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
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Patent number: 8250844Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.Type: GrantFiled: August 17, 2009Date of Patent: August 28, 2012Assignee: W. C. Heraeus GmbHInventor: Jacob E. Markham
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Patent number: 8252252Abstract: Processes for the recovery of ruthenium from materials containing ruthenium or ruthenium oxides or from ruthenium-containing noble metal ore concentrates, with the steps of A. the introduction of the material into a highly alkaline alkali hydroxide melt in the presence of nitrate as oxidizing agent with the formation of an oxidized melt residue with water-soluble ruthenate (RuO4)2?, B. the dissolution of the oxidized melt residue obtained in water, C. the addition of a reducing agent, D. the precipitation of the metals formed, can also be used for separating off selenium. Optionally, ruthenium is separated off by distillation, instead of precipitation, following step B, with the steps of 5C the treatment of the ruthenate-containing solution with an oxidizing agent, 5D distilling off of the RuO4 obtained, 5E taking up of the RuO4 from step 5D in hydrochloric acid. By way of further subsequent purification steps, processes for the recovery of ruthenium targets are obtained.Type: GrantFiled: March 18, 2011Date of Patent: August 28, 2012Assignee: W.C. Heraeus GmbHInventors: Horst Meyer, Matthias Grehl, Christian Nowottny, Martin Stettner, Joachim Kralik
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Patent number: 8153232Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.Type: GrantFiled: March 13, 2008Date of Patent: April 10, 2012Assignee: W.C. Heraeus GmbHInventors: Eckhard Ditzel, Siegfried Walter, Manfred Gresch
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Patent number: 8137518Abstract: A sputter target has a carrier body and a target material arranged on the carrier body, wherein the carrier body has a rear surface facing away from the target material and the target material has a front surface facing away from the carrier body. A ferromagnetic material is arranged between the front surface and the rear surface.Type: GrantFiled: November 25, 2008Date of Patent: March 20, 2012Assignee: W.C. Heraeus GmbHInventors: Hans-Joachim Pavel, Josef Heindel
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Patent number: 8117817Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.Type: GrantFiled: October 9, 2008Date of Patent: February 21, 2012Assignee: W. C. Heraeus GmbHInventors: Jacob E. Markham, Richard W. Koniszczuk
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Publication number: 20110293866Abstract: One aspect relates to a method for connecting a housing of an active implantable medical device to a head part, whereby an uncured joining agent that is arranged, at least in part, between the housing and the head part is transitioned into a cured joining agent to attain a firmly bonded connection. In one embodiment, the uncured joining agent includes monomers of a (meth)acrylic acid alkyl ester, and the cured joining agent includes at least one polymer of the (meth)acrylic acid alkyl ester.Type: ApplicationFiled: May 25, 2011Publication date: December 1, 2011Applicant: W.C. Heraeus GmbHInventors: Heiko Specht, Andreas Reisinger, Klaus Ruppert, Alfred Hohmann
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Patent number: 7999126Abstract: Palladium(0)-dibenzylidene acetone complexes Pdx(dba)y, with y/x being from 1.5 to 3, are provided according to the invention at a purity of at least 99.5 wt. %. The use of said Pdx(dba)y complexes according to the invention is for determining their stoichiometry by means of elemental analysis. In the method for the production of Pdx(dba)y complexes from a Pd-containing educt and dibenzylidene acetone (dba) in alcohol, according to the invention a solution of the dba in alcohol pre-heated to more than 40° C. is provided first and then the Pd-containing educt is added to the pre-heated solution upon which the complexes are precipitated by a base.Type: GrantFiled: April 9, 2008Date of Patent: August 16, 2011Assignee: W.C. Heraeus GmbHInventors: Richard Walter, Horst Meyer, Steffen Voss
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Patent number: 7994692Abstract: A highly heat resistant wire based on niobium or tantalum or niobium tantalum alloy for single-side socket lamps is enriched, according to the invention, with phosphorus and converted into an annealed state. The wire exhibits a yield strength Rp 0.2 of at least 200 MPa or a tensile strength Rm of at least 300 MPa. For the production of a frame for single-side socket lamps, a metal based on niobium or tantalum or an alloy thereof is doped with phosphorus and the doped metal is cold shaped into a wire, this wire is annealed and formed into a frame. This frame is used for the simultaneous current supply and holding of a burner in a single-side socket lamp.Type: GrantFiled: August 11, 2006Date of Patent: August 9, 2011Assignee: W. C. Heraeus GmbHInventor: Bernd Spaniol
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Patent number: 7976804Abstract: A catalyst for the decomposition of N2O under the conditions of the Ostwald process, comprising a carrier and a coating made of rhodium, rhodium/palladium or rhodium oxide applied thereto, ensures to yield NO with a particularly low content of laughing gas as the first process product.Type: GrantFiled: January 9, 2009Date of Patent: July 12, 2011Assignee: W.C. Heraeus GmbHInventors: Uwe Jantsch, Jonathan Lund, Marek Gorywoda, Marcus Kraus