Patents Assigned to Heraeus Medevio GmbH & Co. KG
  • Patent number: 12289840
    Abstract: One aspect relates to a process for producing an electrical medical implant, comprising the following steps: a. providing an electrical feedthrough, which comprises a substrate, an electrical component, and a contact element; b. coating the electrical component with a layer.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: April 29, 2025
    Assignee: Heraeus Medevio GmbH & Co. KG
    Inventor: Ulrich Hausch
  • Publication number: 20240325729
    Abstract: One aspect refers to a lead for a medical device, including a cable comprising an outer insulation having at least one first opening near a distal end of the cable and an inner lumen. The inner lumen is arranged coaxially to the outer insulation. At least one conducting channel is arranged between the outer insulation and the inner lumen. The at least one conducting channel is formed by at least one insulated conductor. The insulation layer comprises a second opening, which is aligned with the at least one first opening. At least one ring electrode surrounds the cable at a position of the at least one aligned first and second opening of the cable. The at least one ring electrode is selectively connected to the conductor of the at least one insulated conductor via a bendable bridging element extending through the at least one aligned first and second opening.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 3, 2024
    Applicant: Heraeus Medevio GmbH & Co. KG
    Inventors: Leoni WILHELM, Mark A. HJELLE, Michael SEFFREN, Andreas REISINGER