Patents Assigned to HERAEUS MEDICAL COMPONENTS, LLC
  • Patent number: 11311717
    Abstract: A lead body for implantation includes at least one segmented electrode with a first electrode segment and a second electrode segment radially positioned about a lumen and electrically isolated from each other. A sectioned hypotube includes a distal end and a proximal end and a first conducting section and a second conducting section each extending between the distal and proximal ends. The first conducting section of the sectioned hypotube is coupled to the first electrode segment adjacent the distal end and the second conducting section of the sectioned hypotube is coupled to the second electrode segment adjacent the distal end.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: April 26, 2022
    Assignee: Heraeus Medical Components LLC
    Inventors: Robert R. Cass, Paul Noffke, Alan Carlson
  • Publication number: 20220023644
    Abstract: One aspect is a method of manufacturing a lead connector for an implantable medical device. The method includes connecting proximal ends of a plurality of conductive pins to a corresponding one of a plurality of ring contacts to form a plurality of ring-pin subassemblies, assembling each of the plurality of ring-pin subassemblies on an assembly frame, including inserting the plurality of conductive pins in a corresponding plurality of openings within the assembly frame such that the corresponding plurality of ring contacts are spaced along a longitudinal dimension of the assembly frame, arranging the assembly frame along with the conductive pins and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material that surrounds the assembly frame, and removing a resulting lead connector from the mold cavity.
    Type: Application
    Filed: July 27, 2021
    Publication date: January 27, 2022
    Applicant: Heraeus Medical Components LLC
    Inventors: Paul SCHUSTER, Jonathan WEST, Benjamin LOCKE
  • Publication number: 20210265084
    Abstract: One example provides a ferrule for an implantable medical device including a frame body having an upper surface and an opposing lower surface, an interior perimeter surface extending between the upper and lower surfaces for attachment to an insulator body, and an exterior perimeter surface extending between the upper and lower surfaces for attachment to a housing. A flange extends from the exterior perimeter surface and has an upper surface facing the upper surface of the frame body, the upper surface of the flange to engage an interior surface of a housing of the implantable medical device to limit a position of the housing along the exterior perimeter surface in a direction toward the bottom surface of the frame body, wherein a distance of the top surface of the flange from the top surface of the frame body is greater than and proportional to a thickness of the housing.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 26, 2021
    Applicant: Heraeus Medical Components LLC
    Inventor: Harold HOLMBERG
  • Publication number: 20210260384
    Abstract: One aspect is a method of forming a lead for implantation. The method includes forming a distal end assembly, forming a proximal end assembly, and forming a flexible circuit coupling the distal end assembly to the proximal end assembly. The distal end assembly, the proximal end assembly and the flexible circuit are formed over an inner member. An outer member is placed over the combination of the distal end assembly, the proximal end assembly and the flexible circuit. The outer member and circuit are fused adjacent the distal end assembly to the proximal end assembly.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 26, 2021
    Applicant: Heraeus Medical Components LLC
    Inventors: Robert R. CASS, Paul NOFFKE, Mark A. HJELLE, Steven E. SCOTT
  • Publication number: 20210260385
    Abstract: On example provides a ferrule for an implantable medical device including a first frame body having a first perimeter surface to make a brazed connection to a first medical device component, and a second frame body having a first perimeter surface to make a welded connection to a second medical device component. A spacer flange connects a second perimeter surface of the first frame body to a second perimeter surface of the second frame body, a thickness between a top surface and bottom of the spacer flange being less than a thickness between a top surface and a bottom surface of the first frame body such that the spacer flange is to deflect relative to the first frame body in response to forces being applied to the second frame body so as to reduce transmission of weld strain from the second frame body to the first frame body.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 26, 2021
    Applicant: Heraeus Medical Components LLC
    Inventor: Harold HOLMBERG
  • Patent number: 11058868
    Abstract: One aspect is a manufacturing method including providing at least a first electrically conductive wire with an electrical insulation and a second electrically conductive wire with an electrical insulation, providing a first and a second ring electrode surrounding the wires, electrically connecting the first ring electrode with the first wire and the second ring electrode with the second wire, bundling the ring electrodes and the wires by means of a first sheath surrounding the ring electrodes and the wires to obtain a first ring electrode component, providing a second ring electrode component, bundling the ring electrode components by means of a second sheath surrounding the ring electrode components, and partially removing the first and the second sheaths from the ring electrodes to expose ring electrode portions.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 13, 2021
    Assignees: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Oliver Keitel, Markus Jung, Mark A. Hjelle, Larry Lark
  • Patent number: 11020599
    Abstract: One aspect is a medical lead interconnect system. The medical lead interconnect system is configured to selectively electrically couple a linear array of contact rings of an implantable medical lead to an electrical outlet coupling. The medical lead interconnect system includes a housing with an electrical outlet, a pair of plates position within the housing and has a plurality of connector pins, a biasing member configured bias the pair of plates toward one another, and a cam configured to rotate between an open position in which the pair of plates are biased towards one another, and a closed position in which the pair plates are forced apart.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: June 1, 2021
    Assignee: Heraeus Medical Components LLC
    Inventors: Paul McSherry, Stephen K. Sundquist, Steven E. Scott, Randall S. Nelson
  • Publication number: 20210154473
    Abstract: One aspect provides a fiducial marker for use with an implantable lead, the fiducial marker having a structure extending along and about a longitudinal axis, the structure having an asymmetrical shape about the longitudinal axis when viewed in any radial direction from the longitudinal axis so as to provide a unique radioscopic silhouette in any radial direction.
    Type: Application
    Filed: November 19, 2020
    Publication date: May 27, 2021
    Applicant: Heraeus Medical Components LLC
    Inventor: Benjamin POBIEL
  • Publication number: 20210031306
    Abstract: One aspect is a device for processing a filament in a process stream, including at least one processing beam source, designed and arranged for emitting at least one processing beam which is suitable for processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament, thereby obtaining a processed filament. The device includes a guide, including a filament feed which is arranged upstream of the at least one processing beam source, and is designed to feed the filament from a feed reel. The guide is designed and arranged to guide the filament so that during the processing the segment of the filament inclines an angle with a vertical axis in the range from 0 to 45°.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Stefan Schibli, Michael Goettlicher, Paul Schuster, Joerg-Martin Gebert
  • Publication number: 20210030292
    Abstract: One aspect relates to a body, including at least one first polymer segment having a porosity p1 and an electrical conductivity c1, and at least one further polymer segment being in seamless contact with the at least one first polymer segment and having a porosity p2?p1 and an electrical conductivity c2?c1. One aspect also relates to a process for the preparation of a body, to a body obtainable by such a process, to the use of a body for electrophysical measurements or as a biosensor and to a therapeutic current delivery or current receiving system comprising the body.
    Type: Application
    Filed: September 24, 2020
    Publication date: February 4, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Robert Dittmer, Leonard Stoica, Jeffrey Hendricks
  • Publication number: 20210023657
    Abstract: One aspect refers to a method for preparing a processed filament, including providing a filament, which comprises a multitude of segments, which follow one another in a longitudinal direction of the filament, wherein each of the segments of the multitude of segments comprises a multitude of sections, which are disposed circumferentially around the filament; and processing the filament in n processing steps, thereby obtaining the processed filament. For each integer i in the range from 1 to n, the ith processing step comprises, for each integer j in the range from 1 to m, processing the jth section of the (i+j?1)th segment. N and m are integers which are, independent from one another, at least 2. Sections of different number are at different circumferential locations of the filament. The processing of each section of each segment of the filament comprises an interaction of the section of the segment of the filament with at least one processing beam.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 28, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Joerg-Martin Gebert, Paul Schuster, Yang Yu
  • Publication number: 20210020335
    Abstract: One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 21, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Jörg-Martin Gebert, Paul Schuster, Lisa Meyer
  • Patent number: 10867720
    Abstract: Composite materials are made by impregnating a non-conductive material with a conducting monomer to form a monomer-impregnated non-conductive material, and polymerizing the monomer-impregnated non-conductive material to form the composite material. The composite materials are used in medical devices and implants.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: December 15, 2020
    Assignee: Heraeus Medical Components LLC
    Inventors: Kyle Mallires, Jeffrey L. Hendricks, Sarah Richardson-Burns, Omar Amirana
  • Publication number: 20200338335
    Abstract: A lead body for implantation includes at least one segmented electrode with a first electrode segment and a second electrode segment radially positioned about a lumen and electrically isolated from each other. A sectioned hypotube includes a distal end and a proximal end and a first conducting section and a second conducting section each extending between the distal and proximal ends. The first conducting section of the sectioned hypotube is coupled to the first electrode segment adjacent the distal end and the second conducting section of the sectioned hypotube is coupled to the second electrode segment adjacent the distal end.
    Type: Application
    Filed: August 13, 2018
    Publication date: October 29, 2020
    Applicant: Heraeus Medical Components LLC
    Inventors: Robert R. CASS, Paul NOFFKE, Alan CARLSON
  • Patent number: 10800931
    Abstract: The invention includes conductive polymeric coatings, medical device, coating solutions and methods of making the same. A coating solution for forming a conductive polymer layer can include a conductive monomer, at least one photoreactive component comprising an anionic photoreactive cross-linking agent or an anionic photoreactive hydrophilic polymer, and a solvent. A medical device can include an electrode and an electrically conductive coating disposed over the electrode. The electrically conductive coating can include a reaction product of the conductive monomer and the at least one photoreactive component. Other aspects are included herein.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: October 13, 2020
    Assignee: Heraeus Medical Components LLC
    Inventors: Jeffrey L. Hendricks, Sarah M. Richardson-Burns, Kyle Mallires, Sarah A. Spanninga, Nathan A. Lockwood, Robert W. Hergenrother, Bruce M. Jelle
  • Patent number: 10731041
    Abstract: The present invention generally relates to compositions and methods for the preparation of conductive polymer coatings, and methods for application of the coatings to three-dimensional substrates.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: August 4, 2020
    Assignee: HERAEUS MEDICAL COMPONENTS LLC
    Inventors: Jeffrey Hendricks, Kyle Mallires, Sarah Richardson-Burns
  • Publication number: 20200206494
    Abstract: One aspect is forming a medical lead for implantation. The method includes forming a plurality of non-ground electrodes, at least one non-ground electrode having a plurality of segments. Overmold portions are formed for the at least one of the plurality of non-ground electrodes, including keys and tabs. One of a plurality of conductors is attached to one segment of the at least one non-ground electrode using the keys and tabs. The non-ground electrodes and plurality of conductors are assembled into electrode assembly and the overmold portions are reflowed. The reflowed electrode assembly is then ground to form the medical lead.
    Type: Application
    Filed: December 18, 2019
    Publication date: July 2, 2020
    Applicant: Heraeus Medical Components LLC
    Inventors: Robert R. Cass, Paul Noffke
  • Publication number: 20200179675
    Abstract: A lead body for implantation includes a first set of conducting sections, a second set of conducting sections, a strain relief coupler having a axial length with a plurality of tines extending along the axial length and extending radially thereby defining a plurality of axially-extending channels, a plurality of joints located within the plurality of channels, each joint coupling one conducting section from the first set of conducting sections to one conducting section from the second set of conducting sections, and an outer layer at least partially surrounding the first and second set of conducting sections, the plurality of joints and the strain relief coupler.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 11, 2020
    Applicant: Heraeus Medical Components LLC
    Inventors: Robert R. Cass, Paul Noffke, Alan Carlson
  • Patent number: 10556089
    Abstract: A catheter or other elongated member can include an elongated inner portion, an elongated outer portion, a flex circuit ribbon comprising at least one conductor, and an electrical contact. The flex circuit ribbon can be situated between the inner portion and the outer portion. The inner portion and the outer portion can be (1) affixed together between portions of the flex circuit ribbon or (2) integrally formed such that masses of the inner and outer portions are joined together between portions of the flex circuit ribbon. The electrical contact can be configured to be exposed during use. The electrical contact can be situated at, or connected to, the at least one conductor of the flex circuit ribbon.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 11, 2020
    Assignee: Heraeus Medical Components LLC
    Inventors: Steven E. Scott, Jahn Stopperan, John Tracy, Greg Closser
  • Publication number: 20200037957
    Abstract: Aspects of the disclosure relate to medical catheters, including electrophysiological catheters, comprising a catheter maintaining at least one electrode including a plurality of electrode segments. The catheter can include a plurality of slots in which the electrodes can be secured so that the electrodes are at least partially positioned within a center lumen of the catheter. Methods of manufacturing medical catheters are also disclosed. In various methods of assembling a catheter, a hollow, tubular catheter made of a compliant material having a very small, micro or nano outside diameter is provided. Then, the slots are formed in the catheter and the electrode segments are positioned within the slots.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 6, 2020
    Applicants: Heraeus Medical Components LLC, Heraeus Deutschland GmbH & Co. KG
    Inventors: Mark A. Hjelle, Katharina Musiol, Christiane Leitold