Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.
Type:
Application
Filed:
May 5, 2014
Publication date:
January 1, 2015
Applicant:
Heraeus Precious Metals North America Conshohocken LLP
Inventors:
Samson Shahbazi, Steven Grabey, Mark Challingsworth