Abstract: A process is provided for manufacturing a sensor arrangement for temperature measurement with a temperature-sensitive measuring resistance which has a thin, metal resistance layer electrically insulated toward the outside, and exposed contact surfaces on a ceramic substrate. The contact surfaces are connected electrically conducting and directly mechanically fast with high temperature-resistant conductor paths electrically insulated from one another on a ceramic carrier element. The measuring resistance is bonded and attached by application to and subsequent firing on a carrier element prepared prior to outfitting. A platinum-containing thick film conducting paste serves as a means for attachment and bonding. Contact surfaces for connecting a plug or cable are arranged at the end of the carrier element facing away from the measuring resistance.