Abstract: A CIS test probe card with an optic assembly is disclosed. At least one embodiment relates to the optic assembly being located close to the CIS test probe card to collimate a light before it is projected through the CIS test probe card to the wafer. At least one embodiment relates to a change in the geometric configuration of the hole(s) and the probe(s) in the CIS test probe card. Small holes corresponding to the CIS chips in a one-on-one fashion can be implemented, such that each small hole is located over a corresponding CIS chip.