Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.

Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.

Abstract: The invention relates to an ultrasonic transducer comprising at least one sensor, particularly for use in ultrasonic bonders. At least one sensor (4, 6) is arranged in/on a mounting (2, 3) of the ultrasonic transducer and, in particular, by means of which a transverse extension perpendicular to a propagating exciting ultrasonic wave can be metrologically detected.

Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.

Abstract: A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.

Abstract: An ultrasonic transducer having an ultrasonic conducting element with a plurality of arms extending from a common junction with some of the arms being provided with ultrasonic generators, at least one other arm carrying a bonding tool, especially for bonding a conductor to a chip and at least two of the arms including a straight angle of 180° with one another.

Abstract: In the forms of a flip-chip package in which the contact elements of the chip are ultrasonically welded to the contact elements of the substrate, either the chip or the substrate or both are provided, prior to juxtaposition, with a bonding material which can be ultrasonically activated. During the ultrasonic welding process in which the contact elements of the chip and substrate are bonded together, the bonding material provides an additional attachment between the chip and substrate and eliminates the need for underfilling.

Abstract: A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.

Abstract: An assembly for electrically connecting a part rotatable about an axis with a relatively stationary part has an elongated multiconductor flat ribbon having a pair of ends and wound in a spiral around the axis. One of the ends is secured to the rotatable part and the other of the ends is secured to the stationary part. The flat ribbon is comprised of a flat elongated tape and a plurality of parallel conductive traces on the tape extending between the ends. The traces are flat strips with a width dimension parallel to the width dimension of the tape. The tape is nonconductive so that the traces are electrically isolated from one another.

Abstract: An ultrasonic transducer having an ultrasonic conducting element with a plurality of arms extending from a common junction with some of the arms being provided with ultrasonic generators, at least one other arm carrying a bonding tool, especially for bonding a conductor to a chip and at least two of the arms including a straight angle of 180° with one another.

Abstract: In the forms of a flip-chip package in which the contact elements of the chip are ultrasonically welded to the contact elements of the substrate, either the chip or the substrate or both are provided, prior to juxtaposition, with a bonding material which can be ultrasonically activated. During the ultrasonic welding process in which the contact elements of the chip and substrate are bonded together, the bonding material provides an additional attachment between the chip and substrate and eliminates the need for underfilling.

Abstract: A wire brake for use with automatic wedge bonding machines which have cutting pliers arranged behind the associated bonding tool and movable along the bonding wire for detaching bonding wire from the open pliers. The wire brake includes guiding members having a plurality of deflectors that can be applied to the bonding wire, the guiding members having two planes from which the bonding wire can be laterally deflected. A central deflector is provided for deflecting the bonding wire from the planes. The central deflector projects between the two planes for guidance of the bonding wire and is displaceable transverse to the longitudinal extension of the bonding wire. Additional guiding members are arranged opposite the planes such that the bonding wire rides between the central deflector and the additional guiding members when the bonding wire is deflected.

Abstract: A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes generating an ultrasonic output table. In the table, the current status of the bonding process is represented as a function of the gradient of deformation of the wire, the impedance of the transducer-bond wedge unit, as well as the currently reached deformation of the wire. The desired gradient of deformation of the wire, a function of the particular status of the process, is specified as the desired value. A correcting variable for the ultrasonic generator is calculated by the addition of correction values formed in the controller to the respective current table values.