Patents Assigned to Hetron
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Patent number: 8509964Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.Type: GrantFiled: June 21, 2011Date of Patent: August 13, 2013Assignee: Hetronic International, Inc.Inventors: Mark Ecton, Torsten Rempe, Max Heckl
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Patent number: 8483887Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.Type: GrantFiled: June 21, 2011Date of Patent: July 9, 2013Assignee: Hetronic International, Inc.Inventors: Mark Ecton, Torsten Rempe, Max Heckl
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Patent number: 8380363Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.Type: GrantFiled: June 21, 2011Date of Patent: February 19, 2013Assignee: Hetronic International, Inc.Inventors: Mark Ecton, Torsten Rempe, Max Heckl
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Patent number: 8295992Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.Type: GrantFiled: March 27, 2008Date of Patent: October 23, 2012Assignee: Hetronic International, Inc.Inventors: Mark Ecton, Torsten Rempe, Max Heckl
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Patent number: 8290646Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device provided with haptic technology for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.Type: GrantFiled: May 12, 2009Date of Patent: October 16, 2012Assignee: Hetronic International, Inc.Inventors: Mark Ecton, Torsten Rempe
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Publication number: 20030146502Abstract: A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or AlxGa1−xN(x>0.69) connected by electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer (which can be W, WC or W2C) have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W2C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. The device can be encapsulated with a reacted borosilicate mixture, with or without an upper die which helps to hold on lead wires and increases structural integrity. Applications include temperature sensors, pressure sensors, chemical sensors, and high temperature and high power electronic circuits.Type: ApplicationFiled: June 20, 2002Publication date: August 7, 2003Applicant: HetronInventor: James D. Parsons
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Publication number: 20030010917Abstract: Single crystal SiC at least 200 micrometers thick is employed to detect electromagnetic radiation having a wavelength less than about 10 micrometers via an acoustic absorption mechanism. Applications include IR radiation sensing, contactless temperature sensing and an IR controlled varistor.Type: ApplicationFiled: July 16, 2001Publication date: January 16, 2003Applicant: HETRONInventor: James D. Parsons
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Publication number: 20020179992Abstract: A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or AlxGa1−xN(x>0.69) connected by electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer (which can be W, WC or W2C) have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W2C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. The device can be encapsulated with a reacted borosilicate mixture, with or without an upper die which helps to hold on lead wires and increases structural integrity. Applications include temperature sensors, pressure sensors, chemical sensors, and high temperature and high power electronic circuits.Type: ApplicationFiled: June 20, 2002Publication date: December 5, 2002Applicant: HetronInventor: James D. Parsons
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Patent number: 6239432Abstract: SiC, preferably in single crystal form, is employed as an IR radiation sensor with high temperature and power capabilities. Applications include sensing the power or energy from an IR radiation source, a contactless temperature sensor for another body heated by IR radiation, and an IR controlled varistor.Type: GrantFiled: May 21, 1999Date of Patent: May 29, 2001Assignee: HetronInventor: James D. Parsons