Patents Assigned to Hetron
  • Patent number: 8509964
    Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: August 13, 2013
    Assignee: Hetronic International, Inc.
    Inventors: Mark Ecton, Torsten Rempe, Max Heckl
  • Patent number: 8483887
    Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: July 9, 2013
    Assignee: Hetronic International, Inc.
    Inventors: Mark Ecton, Torsten Rempe, Max Heckl
  • Patent number: 8380363
    Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 19, 2013
    Assignee: Hetronic International, Inc.
    Inventors: Mark Ecton, Torsten Rempe, Max Heckl
  • Patent number: 8295992
    Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: October 23, 2012
    Assignee: Hetronic International, Inc.
    Inventors: Mark Ecton, Torsten Rempe, Max Heckl
  • Patent number: 8290646
    Abstract: The present invention is directed to a remote control system for controlling a railway vehicle. The remote control system including a remote control device provided with haptic technology for transmitting signals to a first controller module. The first controller is mounted to the railway vehicle and controls and monitors the functions of the railway vehicle. The first controller module also relays information to the remote control device. The remote control system can also include a portable safety switch allowing any individual in proximity to the railway vehicle to send a stop signal to the first controller module to stop the railway vehicle if any unsafe conditions exist.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: October 16, 2012
    Assignee: Hetronic International, Inc.
    Inventors: Mark Ecton, Torsten Rempe
  • Publication number: 20030146502
    Abstract: A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or AlxGa1−xN(x>0.69) connected by electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer (which can be W, WC or W2C) have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W2C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. The device can be encapsulated with a reacted borosilicate mixture, with or without an upper die which helps to hold on lead wires and increases structural integrity. Applications include temperature sensors, pressure sensors, chemical sensors, and high temperature and high power electronic circuits.
    Type: Application
    Filed: June 20, 2002
    Publication date: August 7, 2003
    Applicant: Hetron
    Inventor: James D. Parsons
  • Publication number: 20030010917
    Abstract: Single crystal SiC at least 200 micrometers thick is employed to detect electromagnetic radiation having a wavelength less than about 10 micrometers via an acoustic absorption mechanism. Applications include IR radiation sensing, contactless temperature sensing and an IR controlled varistor.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 16, 2003
    Applicant: HETRON
    Inventor: James D. Parsons
  • Publication number: 20020179992
    Abstract: A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or AlxGa1−xN(x>0.69) connected by electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer (which can be W, WC or W2C) have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W2C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. The device can be encapsulated with a reacted borosilicate mixture, with or without an upper die which helps to hold on lead wires and increases structural integrity. Applications include temperature sensors, pressure sensors, chemical sensors, and high temperature and high power electronic circuits.
    Type: Application
    Filed: June 20, 2002
    Publication date: December 5, 2002
    Applicant: Hetron
    Inventor: James D. Parsons
  • Patent number: 6239432
    Abstract: SiC, preferably in single crystal form, is employed as an IR radiation sensor with high temperature and power capabilities. Applications include sensing the power or energy from an IR radiation source, a contactless temperature sensor for another body heated by IR radiation, and an IR controlled varistor.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: May 29, 2001
    Assignee: Hetron
    Inventor: James D. Parsons