Patents Assigned to Hewlett-Packard Devlepment Company, L.P.
  • Patent number: 7226156
    Abstract: A fluid ejection assembly includes a platform having a fluid inlet, a fluid outlet, a plurality of fluid feed slots, and a fluid manifold defined therein, and a plurality of fluid ejection devices each mounted on the platform and including an array of drop ejecting elements and a fluid refill slot communicating with the array of drop ejecting elements. The fluid refill slot of each of the fluid ejection devices communicates with at least one of the fluid feed slots of the platform, and the fluid manifold of the platform fluidically couples each of the fluid feed slots with the fluid inlet and the fluid outlet of the platform.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: June 5, 2007
    Assignee: Hewlett-Packard Devlepment Company, L.P.
    Inventors: Melissa D Boyd, Timothy E Beerling, Timothy L Weber