Patents Assigned to Hewlett Packard Enterprise Development
  • Subscription to a subset of switching events
    Patent number: 10560317
    Abstract: Examples herein disclose a processor to receive a list of switching events. The list of switching events is internal to a networking device and capable of detection by a programmable engine. The processor subscribes to a subset of the switching events based on a selection from the list of switching events.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: February 11, 2020
    Assignee: Hewlett Packard Enterprise Development
    Inventors: Diego Valverde Garro, Claudio Enrique Viquez Calderon, Jose Daniel Hernandez Vargas, Osvaldo Andres Sanchez Melendez
  • Module board coupling
    Patent number: 10534138
    Abstract: In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: January 14, 2020
    Assignee: Hewlett Packard Enterprise Development
    Inventors: Kevin B. Leigh, Sunil Ganta, John Norton, George D. Megason
  • SEMICONDUCTOR ASSEMBLY
    Publication number: 20190045650
    Abstract: An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.
    Type: Application
    Filed: January 26, 2016
    Publication date: February 7, 2019
    Applicant: Hewlett Packard Enterprise Development
    Inventors: Kevin B. Leigh, George D. Megason