Patents Assigned to Hexcel Composites, S.A.S
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Patent number: 9314992Abstract: A structural panel comprising an internal core material having first and second opposing faces, first and second face sheets bonded to the first and second opposing faces respectively, wherein the panel comprises an open-structured sheet, interposed between a first face of the core material and its respective face sheet and the panel comprises less than 200 gsm adhesive.Type: GrantFiled: January 17, 2011Date of Patent: April 19, 2016Assignees: Hexcel Composites, Ltd., Hexcel Composites, S.A.S.Inventors: Steve Mortimer, Emille Legoff, Bertrand Germain, Clement Casaliggi, Sarah Lasfargues
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Patent number: 9051444Abstract: A process for the manufacture of a prepreg comprising feeding a layer of unidirectional conductive fibers having a defined width, bringing into contact with a first face of the fibers a first layer of resin comprising thermosetting resin, and compressing the resin and fibers together by passing over one or more impregnation rollers, wherein the pressure exerted onto the conductive fibers and resin does not exceed 40 kg per centimeter of the width of the conductive fibers, and the resin being in sufficient amount for the resin to enter the interstices of the fibers and leave a first outer layer of resin essentially free of unidirectional conductive fibers.Type: GrantFiled: June 25, 2010Date of Patent: June 9, 2015Assignees: Hexcel Composites Limited, Hexcel Composites, S.A.S.Inventors: John Ellis, Emille Fisset, David Tilbrook, Paul Mackenzie, Isabelle Blanc, Lucien Fiore, Bernadette Tizon
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Patent number: 8747720Abstract: The processing window for thermosetting resins that contain particulate hardeners is prolonged using the combined steps of heat-treating the resin to form a low-viscosity resin mixture in which the particles are dissolved and then molding the low-viscosity resin mixture at temperatures below the dissolution temperature of the particles to infuse a fibrous preform. The infused resin preform is heated to the curing temperature of the resin to provide final curing of the resin.Type: GrantFiled: September 14, 2009Date of Patent: June 10, 2014Assignees: Hexcel Composites, S.A.S., Hexcel Composites, Ltd.Inventors: Stephen Mortimer, Neal Patel, Estaban Vilalon
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Publication number: 20120301665Abstract: A structural panel comprising an internal core material having first and second opposing faces, first and second face sheets bonded to the first and second opposing faces respectively, wherein the panel comprises an open-structured sheet, interposed between a first face of the core material and its respective face sheet and the panel comprises less than 200 gsm adhesive.Type: ApplicationFiled: January 17, 2011Publication date: November 29, 2012Applicants: HEXCEL COMPOSITES, S.A.S., HEXCEL COMPOSITES, LTDInventors: Steve Mortimer, Emille Legoff, Bertrand Germain, Clement Casaliggi, Sarah Lasfargues
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Publication number: 20120146256Abstract: The processing window for thermosetting resins that contain particulate hardeners is prolonged using the combined steps of heat-treating the resin to form a low-viscosity resin mixture in which the particles are dissolved and then moulding the low-viscosity resin mixture at temperatures below the dissolution temperature of the particles to infuse a fibrous preform. The infused resin preform is heated to the curing temperature of the resin to provide final curing of the resin.Type: ApplicationFiled: September 14, 2009Publication date: June 14, 2012Applicants: HEXCEL COMPOSITES, S.A.S, HEXCEL COMPOSITES, LTD.Inventors: Stephen Mortimer, Neal Patel, Estaban Vilalon
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Publication number: 20120100362Abstract: A process for the manufacture of a prepreg comprising feeding a layer of unidirectional conductive fibres having a defined width, bringing into contact with a first face of the fibres a first layer of resin comprising thermosetting resin, and compressing the resin and fibres together by passing over one or more impregnation rollers, wherein the pressure exerted onto the conductive fibres and resin does not exceed 40 kg per centimetre of the width of the conductive fibres, and the resin being in sufficient amount for the resin to enter the interstices of the fibres and leave a first outer layer of resin essentially free of unidirectional conductive fibres.Type: ApplicationFiled: June 25, 2010Publication date: April 26, 2012Applicants: Hexcel Composites, S.A.S, Hexcel Composites Ltd.Inventors: John Ellis, Emille Fisset, David Tilbrook, Paul MacKenzie, Isabelle Blanc, Lucien Fiore, Bernadette Tizon