Abstract: A large machining apparatus for working a substantially planar workpiece such as a metal plate in relation to which a set of work actions, such as machining grooves and holes, is required at one of a number of work zones on or in the workpiece, the apparatus including: a working assembly such as a drop down drill movably mounted on a beam for reciprocal linear movement along a first horizontal axis extending parallel to the longitudinal axis of the workpiece; and an assembly rail movably mounted on the beam at right angles to the beam to carry the working assembly.
Type:
Grant
Filed:
June 22, 2009
Date of Patent:
June 11, 2013
Assignee:
HG-Farley Laserlab Co. Pty Ltd
Inventors:
Damiano A. Messina, Zuozhang Li, Quan Wang, Mark Riddell
Abstract: A large machining apparatus for working a substantially planar workpiece such as a metal plate in relation to which a set of work actions, such as machining grooves and holes, is required at one of a number of work zones on or in the workpiece, the apparatus including: a working assembly such as a drop down drill movably mounted on a beam for reciprocal linear movement along a first horizontal axis extending parallel to the longitudinal axis of the workpiece; and an assembly rail movably mounted on the beam at right angles to the beam to carry the working assembly.
Type:
Application
Filed:
June 22, 2009
Publication date:
February 11, 2010
Applicant:
HG - Farley Laserlab Co. Pty Ltd
Inventors:
Damiano A. Messina, Zuozhang Li, Quan Wang, Mark Riddell