Patents Assigned to HGCI, INC.
  • Patent number: 12222085
    Abstract: A light fixture includes a lighting module and a ballast. The ballast includes a housing and a power module. The housing includes a front cover and a rear cover. The front cover includes a front wall and upper fins and lower fins that extend from the front wall. The rear cover includes a rear wall and first fins and second fins that extend from the rear wall. The power module includes a plurality of heat generating semiconductor components that are thermally coupled with the rear wall to facilitate cooling thereof.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: February 11, 2025
    Assignee: HGCI, Inc.
    Inventor: Dengke Cai
  • Patent number: 12096734
    Abstract: A heater includes an enclosure, a first baffle plate, and a second baffle plate. The enclosure includes a first wall, a second wall opposite the first wall, and a top plate extending between the first wall and the second wall and cooperating with the first wall and the second wall to at least partially define an interior. The heating module is coupled with the enclosure and is disposed beneath the first baffle plate and the second baffle plate. The heater can additionally or alternatively include an air quality monitoring system and an isolation transformer. The air quality monitoring system includes an air quality controller, at least one air quality sensor, and a power input. The isolation transformer is configured to deliver power from the air quality monitoring system to a fuel system controller of the heating module to facilitate powering thereof.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: September 24, 2024
    Assignee: HGCI, Inc.
    Inventors: Dengke Cai, Martin R. Mason, Daniel Martin Horjus
  • Patent number: 12069994
    Abstract: A light fixture includes a housing, and a lighting module. The housing defines first and second portions. The second portion defines a window. The lighting module is at least partially disposed in the second portion. The lighting module includes a submount, a plurality of light emitting diodes, a lens cover, and an encapsulating material. The plurality of light emitting diodes is coupled with the submount and is configured to project light through the window. The lens cover includes an exterior surface and overlies the plurality of light emitting diodes and the submount such that the lens cover and the submount define an interior therebetween. The encapsulating material substantially fills the interior.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: August 27, 2024
    Assignee: HGCI, Inc.
    Inventor: Dengke Cai
  • Patent number: 11988358
    Abstract: A light fixture includes a lighting module and a ballast. The ballast includes a housing and a power module. The housing includes a front cover and a rear cover. The front cover includes a front wall and upper fins and lower fins that extend from the front wall. The rear cover includes a rear wall and first fins and second fins that extend from the rear wall. The power module includes a plurality of heat generating semiconductor components that are thermally coupled with the rear wall to facilitate cooling thereof.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: May 21, 2024
    Assignee: HGCI, Inc.
    Inventor: Dengke Cai
  • Patent number: 11877551
    Abstract: A vertically disposed HID lamp fixture for growing plants, which includes a housing having an interior, an exterior, a top hole, and a lower lip defining a light opening towards the plants, further including an inlet duct and outlet duct for the forced air cooling embodiment, a socket tower having an upper flange and a lower flange, the upper flange affixed around the perimeter of the top hole securing the socket tower to the housing, a reflector having an aperture, the lower flange affixed around the perimeter of the aperture suspends the reflector within the housing such that an isolation chamber is formed between the exterior side of the reflector and the interior of the housing, a HID lamp removably engages within said socket tower longitudinally extending substantially downward and through said aperture vertically disposed above said light opening sealed by a compressively held glass sheet.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 23, 2024
    Assignee: HGCI, Inc.
    Inventor: John Stanley
  • Patent number: D998229
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: September 5, 2023
    Assignee: HGCI, Inc.
    Inventor: John Stanley
  • Patent number: D1002917
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: October 24, 2023
    Assignee: HGCI, Inc.
    Inventor: Dengke Cai
  • Patent number: D1007045
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: December 5, 2023
    Assignee: HGCI, Inc.
    Inventor: John Stanley
  • Patent number: D1018946
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: March 19, 2024
    Assignee: HGCI, Inc.
    Inventor: William Wai-Loong Young
  • Patent number: D1022309
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: April 9, 2024
    Assignee: HGCI, Inc.
    Inventor: Christopher Reynolds
  • Patent number: D1023428
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: April 16, 2024
    Assignee: HGCI, Inc.
    Inventors: Martin Carskadon, Martin R. Mason
  • Patent number: D1029337
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: May 28, 2024
    Assignee: HGCI, Inc.
    Inventor: Doug Hargreaves
  • Patent number: D1030031
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: June 4, 2024
    Assignee: HGCI, Inc.
    Inventors: Dengke Cai, Martin R. Mason, Jr., Daniel Martin Horjus
  • Patent number: D1048526
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: October 22, 2024
    Assignee: HGCI, Inc.
    Inventors: Yongfeng Huo, Dengke Cai
  • Patent number: D1049454
    Type: Grant
    Filed: January 8, 2022
    Date of Patent: October 29, 2024
    Assignee: HGCI, Inc.
    Inventors: Dengke Cai, William Wai-Loong Young, Vincent Sebastiaan Steen
  • Patent number: D1049465
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: October 29, 2024
    Assignee: HGCI, Inc.
    Inventors: Nico Romers, Dengke Cai
  • Patent number: D1049466
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: October 29, 2024
    Assignee: HGCI, Inc.
    Inventors: Nico Romers, Dengke Cai
  • Patent number: D1049467
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: October 29, 2024
    Assignee: HGCI, Inc.
    Inventors: Nico Romers, Dengke Cai
  • Patent number: D1049468
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: October 29, 2024
    Assignee: HGCI, Inc.
    Inventors: Nico Romers, Dengke Cai
  • Patent number: D1050562
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: November 5, 2024
    Assignee: HGCI, Inc.
    Inventor: Christopher Reynolds