Patents Assigned to HGCI LLC
  • Patent number: 12553598
    Abstract: A light fixture includes a lighting module and a heat sink. The lighting module includes a plurality of light emitting diodes and a heat sink. The light emitting diodes are configured to project light onto an area beneath the light fixture. The heat sink overlies the lighting module and is configured to dissipate heat away from the lighting module. The heat sink includes a base plate, a first base fin and a second base fin. The first base fin extends upwardly from the base plate. The second base fin extends upwardly from the base plate and is spaced from the first base fin.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: February 17, 2026
    Assignee: HGCI LLC
    Inventor: Dengke Cai
  • Patent number: D1131875
    Type: Grant
    Filed: October 7, 2024
    Date of Patent: June 23, 2026
    Assignee: HGCI LLC
    Inventors: Dengke Cai, Han Ren