Abstract: Embodiments of the present invention are directed to a method and system for disabling distracting features of electronic devices in a moving vehicle in order to enhance vehicle operator safety. A safety controller system may be operatively connected with a motion monitor within a vehicle and with a computing device in communication with the motion monitor. The safety controller system may include a motion monitor communication component for continuously receiving data from the motion monitor, which may be a GPS system installed within the vehicle. The safety controller system may additionally include a feature disabling module for disabling a feature of the electronic device based on detected motion conditions determined from the received data and a feature enabling module for enabling the feature of the electronic device based on a detected lack of motion determined from the received data.

Abstract: Embodiments of the present invention are directed to a method and system for disabling distracting features of electronic devices in a moving vehicle in order to enhance vehicle operator safety. A safety controller system may be operatively connected with a motion monitor within a vehicle and with a computing device in communication with the motion monitor. The safety controller system may include a motion monitor communication component for continuously receiving data from the motion monitor, which may be a GPS system installed within the vehicle. The safety controller system may additionally include a feature disabling module for disabling a feature of the electronic device based on detected motion conditions determined from the received data and a feature enabling module for enabling the feature of the electronic device based on a detected lack of motion determined from the received data.

Abstract: A method for separating a mask from the surface of a semiconductor wafer comprises first mounting a mask/wafer combination on a rotatable surface and then rotating the rotatable surface. A separating device is inserted at the edge of the mask between the two mating services of the mask and the semiconductor wafer. The semiconductor device is then urged upward toward the rotating center of the mask/wafer combination while the rotatable surface is rotating.