Abstract: Proposed is a memory module socket capable of increasing electrical contact reliability. The memory module socket includes a socket body (100) including a slot (111) in which terminals (13) of a memory module are inserted, a plurality of receiving portions (113) symmetrically defined by a plurality of partition walls (112), and a stopper member (114) provided under the slot (111), at least one pair of contacts (200) symmetrically provided in each pair of receiving portions (113); and an elastic body (300) inserted into the socket body (100). Each of the contacts (200) includes a curved portion (210), an outer extension portion (220), a first protrusion (222), an inner extension portion (230), an inclined extension portion (240) including a first contact protrusion (240a), and a vertical extension portion (250). Each of the receiving portions (113) includes restraining surfaces (118a and 118b).

Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

Abstract: Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements (100, 200) into which contacts (400) are inserted; movable elements (300, 500) on which a semiconductor device (IC) is seated; a socket cover (600) assembled to the movable elements (300, 500) and resiliently assembled to the body elements (100, 200); and a semiconductor device pressing part (700) pressing and fixing the semiconductor device (IC) seated on the movable elements (300, 500), wherein the semiconductor device pressing part (700) includes: a pusher plate (710) having an opening cam (711) and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch (720) of which ends are hingedly assembled to the socket cover (600) and the pusher plate (710); and a link (730) of which ends are hingedly assembled to the socket body (100) and the latch (720).

Abstract: The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion 32 having an upper tip 31 protruding upward; a spring portion (36) formed by a strip cylindrically bent, the strip extending in a zigzag pattern from an upper connection portion 35 extending downward from the upper head portion 32; a lower head portion 39 extending downward from a lower connection 37 extending from the lower end of the spring portion 36; and a lower tip 40 being provided on the lower end of the lower head portion 39. The present invention is advantageously suitable for manufacturing a fine-pitch spring contact and can improve productivity and reduce manufacturing costs.

Abstract: Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements (100, 200) into which contacts (400) are inserted; movable elements (300, 500) on which a semiconductor device (IC) is seated; a socket cover (600) assembled to the movable elements (300, 500) and resiliently assembled to the body elements (100, 200); and a semiconductor device pressing part (700) pressing and fixing the semiconductor device (IC) seated on the movable elements (300, 500), wherein the semiconductor device pressing part (700) includes: a pusher plate (710) having an opening cam (711) and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch (720) of which ends are hingedly assembled to the socket cover (600) and the pusher plate (710); and a link (730) of which ends are hingedly assembled to the socket body (100) and the latch (720).

Abstract: The present invention relates to a socket device for testing a semiconductor device. More particularly, the present invention relates to a socket device that is capable of testing ball grid array (BGA) and land grid array (LGA) type semiconductor devices, or BGA/LGA hybrid semiconductor devices according to the shapes of leads of the semiconductor devices. A latch structure for pressing and holding a semiconductor device is improved such that a roller is provided at the front end of a latch so as to minimize wear caused by friction with a sandpaper-like surface on an upper surface of the semiconductor device, even in the case of approximately one hundred thousand or more rounds of testing, thereby remarkably extending the life of the socket device, increasing testing efficiency, and reducing costs.

Abstract: Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized.

Abstract: The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion 32 having an upper tip 31 protruding upward; a spring portion (36) formed by a strip cylindrically bent, the strip extending in a zigzag pattern from an upper connection portion 35 extending downward from the upper head portion 32; a lower head portion 39 extending downward from a lower connection 37 extending from the lower end of the spring portion 36; and a lower tip 40 being provided on the lower end of the lower head portion 39. The present invention is advantageously suitable for manufacturing a fine-pitch spring contact and can improve productivity and reduce manufacturing costs.

Abstract: The present invention relates to a socket device for testing a semiconductor device. More particularly, the present invention relates to a socket device that is capable of testing ball grid array (BGA) and land grid array (LGA) type semiconductor devices, or BGA/LGA hybrid semiconductor devices according to the shapes of leads of the semiconductor devices. A latch structure for pressing and holding a semiconductor device is improved such that a roller is provided at the front end of a latch so as to minimize wear caused by friction with a sandpaper-like surface on an upper surface of the semiconductor device, even in the case of approximately one hundred thousand or more rounds of testing, thereby remarkably extending the life of the socket device, increasing testing efficiency, and reducing costs.

Abstract: Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized.

Abstract: A spring contact and a socket embedded with spring contacts. The spring contact includes an upper contact pin having a contact portion, two spring holding protrusions and a body, a lower contact pin coupled to the upper contact pin, and a spring fitted over the assembly of the upper and lower contact pins, wherein the body has two symmetric elastic portions with both an oblique surface and a locking protrusion, in which a moving slit is formed between the elastic portions so as to provide a moving space for an opposite contact pin, with moving grooves being formed to movably receive the locking protrusions of an opposite contact pin and to be in electric contact with the locking protrusions.

Abstract: A spring contact, including: an upper contact pin having a contact portion, a head, a neck, a body and two spring holding protrusions; a lower contact pin having a construction that is the same as or similar to that of the upper contact pin and being coupled to the upper contact pin while crossing at right angles; and a spring fitted over an assembly of the upper and lower contact pins, wherein to increase the strength of the upper contact pin and increase the surface area of the contact portion, the head forms a cylindrical or square column shape or a part of the contact pin within the range from the contact portion to the spring holding protrusions has a thickness greater than the thickness of the body, thereby increasing the strength of the upper contact pin and increasing the surface area of the contact portion.

Abstract: The present invention relates to a spring contact and a socket embedded with spring contacts.