Patents Assigned to HID Global GmbH
  • Patent number: 9935433
    Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: April 3, 2018
    Assignee: HID GLOBAL GMBH
    Inventor: Manfred Michalk
  • Patent number: 9531171
    Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: December 27, 2016
    Assignee: HID Global GmbH
    Inventor: Manfred Michalk
  • Publication number: 20160372901
    Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.
    Type: Application
    Filed: August 30, 2016
    Publication date: December 22, 2016
    Applicant: HID Global GmbH
    Inventor: Manfred MICHALK
  • Patent number: 9178265
    Abstract: The invention concerns a support for an antenna, such as a RFID antenna, used in a flexible cover, for example a passport cover, whereby said antenna is surrounded by material of said cover. Said support comprises means for disconnecting the antenna from the surrounding material so that bending stress applied to said material is not transferred to the antenna. The support may be used in different products, for example in passports.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: November 3, 2015
    Assignee: HID GLOBAL GMBH
    Inventors: Hermann Hecker, Paul Shane Doran
  • Patent number: 9111401
    Abstract: An access control system and a method of operating the same are provided. The access control system includes an interactive reader commander that intercepts commands transmitted from a computing device to a reader and determines if the intercepted commands are security-relevant. Security-relevant commands and possibly other commands are stored unless and until a valid user input is received at the interactive reader commander.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: August 18, 2015
    Assignee: HID GLOBAL GMBH
    Inventors: Helmut Dansachmueller, Daniel Halber, Eric Fernand Le Saint
  • Patent number: 9023169
    Abstract: The invention refers to a method for manufacturing such a functional laminate, the method comprising the following steps: providing at least one patchwork layer; stacking the patchwork layer with at least one other layer in order to obtain a stack of layers, wherein at least one proximate layer directly adjacent to the patchwork layer comprises at least one zone comprising a first material or a second material; laminating the stack of layers together by heat and/or pressure and/or gluing.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: May 5, 2015
    Assignee: Hid Global GmbH
    Inventors: Manfred Michalk, Franziska Hofmann, Andreas Griesbach
  • Patent number: 8946099
    Abstract: The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: February 3, 2015
    Assignee: HID Global GmbH
    Inventor: Manfred Michalk
  • Publication number: 20140144985
    Abstract: An access control system and a method of operating the same are provided. The access control system includes an interactive reader commander that intercepts commands transmitted from a computing device to a reader and determines if the intercepted commands are security-relevant. Security-relevant commands and possibly other commands are stored unless and until a valid user input is received at the interactive reader commander.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 29, 2014
    Applicant: HID Global GmbH
    Inventors: Helmut Dansachmueller, Daniel Halber, Eric Fernand Le Saint
  • Patent number: 8646675
    Abstract: The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 11, 2014
    Assignee: HID Global GmbH
    Inventor: Ulrich Lang
  • Patent number: 8619244
    Abstract: A method to test the authenticity of a document (1), such as an ID, a passport or a card, protected against forgery, wherein it comprises at least an inner co-laminated fabric layer (2) forming an optical watermark. This layer presents cuts, and so separated zones with fabric material and other zones without fabric material, forming well recognizable forms or pictures. Co-laminating one or a plurality of such fabric layers inside of the document body allows to create a multiple watermark having both surface relief and opacity effect, without adding any volume to the body of the document.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: December 31, 2013
    Assignee: HID Global GmbH
    Inventors: Hermann Hecker, Andreas Griesbach
  • Patent number: 8584222
    Abstract: A secure password/Personal Identification Number (PIN) reset process is disclosed. The process involves replacing a transportation password/PIN of a terminal with a user-specific password/PIN. During the replacement, the user-specific password/PIN is bound with a token. The token can then be used to securely reset the password/PIN of the terminal back to the transportation password/PIN if the user-specific password/PIN is forgotten or compromised.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: November 12, 2013
    Assignee: HID Global GmbH
    Inventors: Markus Andreas Hofer, Werner Waitz
  • Publication number: 20130207874
    Abstract: The invention concerns a support for an antenna, such as a RFID antenna, used in a flexible cover, for example a passport cover, whereby said antenna is surrounded by material of said cover. Said support comprises means for disconnecting the antenna from the surrounding material so that bending stress applied to said material is not transferred to the antenna. The support may be used in different products, for example in passports.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 15, 2013
    Applicant: HID GLOBAL GMBH
    Inventor: HID GLOBAL GMBH
  • Patent number: 8295298
    Abstract: A Local Area Network (LAN) device is provided that includes an integrated switching function and a single network port. More specifically, the single network port of the LAN device may be used to provide communications over two different channels to/from two different external network devices. Thus, the LAN device may be utilized as an intermediary network device in a bus or chain network configuration even though it only comprises a single network port.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: October 23, 2012
    Assignee: HID Global GmbH
    Inventors: Juergen Kastner, Uwe Schnabel
  • Patent number: 8286332
    Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: October 16, 2012
    Assignee: HID Global GmbH
    Inventors: Ulrich Lang, Lionel Carre, Viroel-Marian Hasegan, David Finn
  • Publication number: 20120038141
    Abstract: The invention concerns a functional laminate and a method for manufacturing said functional laminate, the method comprising the following steps:—providing a substrate sheet (1);—inserting at least one functional component (2) into the substrate sheet (1);—wearing out the substrate sheet (1) and/or at least one layer laminated to the substrate sheet (1) in an area adjacent to the functional component (2) resulting in at least one recess (5) with a small width in proportion to dimensions of the functional component (2) before at least one lamination step;—carrying out at least one lamination step, wherein the substrate sheet (1) is laminated with at least one additional layer by heat and/or pressure and/or gluing in such a manner that the width of the at least one recess (5) is considerably reduced or the at least one recess (5) is barely shut at least by surrounding material after lamination by virtue of shrinking of the substrate sheet (1) and/or the at least one additional layer.
    Type: Application
    Filed: February 22, 2010
    Publication date: February 16, 2012
    Applicant: HID GLOBAL GMBH
    Inventor: Manfred Michalk
  • Patent number: 7971339
    Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: July 5, 2011
    Assignee: HID Global GmbH
    Inventor: David Finn
  • Patent number: 7967213
    Abstract: The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: June 28, 2011
    Assignee: HID Global GmbH
    Inventor: Manfred Michalk
  • Patent number: D716304
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 28, 2014
    Assignee: HID GLOBAL GmbH
    Inventor: Markus Orthey
  • Patent number: D726179
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: April 7, 2015
    Assignee: HID Global GmbH
    Inventor: Markus Orthey
  • Patent number: D734194
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: July 14, 2015
    Assignee: HID GLOBAL GMBH
    Inventors: Jurgen Kastner, Markus Pretschuh