Patents Assigned to Hidenobu Iwata
  • Patent number: 5845655
    Abstract: A hair bundling core structure comprising an elastic cylinder made of a foamed synthetic resin having a thickness and a strength which are sufficient for facilitating the insertion and extraction of a hair setting U-shaped pin and are capable of fixing the hair by the insertion. The core structure is cut from one end face to the other thereof to have a rift.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: December 8, 1998
    Assignees: Yonesho Company Ltd., Hidenobu Iwata
    Inventor: Hidenobu Iwata