Patents Assigned to Hideo HONMA
  • Microporous copper film and electroless copper plating solution for obtaining the same
    Publication number: 20020046679
    Abstract: A copper metal film having 105 to 109 micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a completing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond.
    Type: Application
    Filed: November 9, 2001
    Publication date: April 25, 2002
    Applicant: Hideo HONMA
    Inventors: Hideo Honma, Tomoyuki Fujinami, Nobuo Ebina