Patents Assigned to High Performance Computing
  • Lead free tin based solder composition
    Publication number: 20030183674
    Abstract: Lead-free solder alloys based on a Sn—Ag—Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn—Pb solder, and can thus be a readily substituted for conventional Sn—Pb solders. P may be added to the alloy compositions to reduce its tendency of oxidation.
    Type: Application
    Filed: August 9, 2002
    Publication date: October 2, 2003
    Applicant: High Performance Computing
    Inventors: Ping Wu, Kewu Bai
  • Lead free tin based solder composition
    Publication number: 20030183675
    Abstract: Lead-free solder alloys based on a Sn—Zn—Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn—Pb solder, and can thus be a readily substituted for conventional Sn—Pb solders. P may be added to the alloy compositions to reduce its tendency of oxidation.
    Type: Application
    Filed: August 9, 2002
    Publication date: October 2, 2003
    Applicant: High Performance Computing
    Inventors: Ping Wu, Kewu Bai