Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform, an electrical discharge machining unit and a repairing device. The carrier platform is used for carrying at least one to-be-machined object. The electrical discharge machining unit comprises at least one electrode and a power supply unit, and is used for performing an electrical discharge machining procedure on a machined target area of the to-be-machined object by the electrode along a machining direction. When there is an area to be repaired on an appearance of the electrode, the repairing device performs a repairing procedure on the electrode, thereby achieving effects of stable electrical discharge and preventing short-circuit problem in the electrical discharge machining procedure.

Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform and an electrical discharge machining unit. The carrier platform is used to carry at least one to-be-machined object. The electrical discharge machining unit comprises an electrode, a jig and a power supply unit. When the electrical discharge machining unit performs an electrical discharge machining procedure on a machined target area of the to-be-machined object along a machining direction, an electrical discharge section of the electrode and the machined target area of the to-be-machined object move relatively. The invention is capable of improving a machining procedure, saving an overall machining time and saving a time required for electrode replacement.

Abstract: A fast annealing equipment is applicable to the annealing treatment of silicon carbide wafers. The fast annealing equipment comprises a variable frequency microwave power source system, a resonant chamber heating system and a measurement and control system. The variable frequency microwave power source system uses a solid state power amplifier and has the flexibility of fast frequency sweep during heat treatment to compensate for resonant frequency changes due to load effect caused by temperature changes in a material to be annealed. In order to improve an energy efficiency and provide a sufficient microwave energy uniform area, the TM010 resonant chamber structure can be used to anneal 4-inch to 8-inch silicon carbide wafers. The measurement and control system combines software and hardware to form an automatic system with instant feedback to provide further flexibility, stability and reliability for the entire equipment.

Abstract: A self-cleaning negative-pressure ejector at least comprises a suction chamber, a jet pipe and a flushing member. A side wall of the suction chamber has at least one suction port for communicating with a first fluid pipeline. An exit port of the jet pipe is disposed in the suction chamber and ejects a second fluid so that a negative pressure is generated in the suction chamber, a first fluid in the first fluid pipeline enters the suction chamber, and a first included angle is between a direction in which the first fluid being sucked into the suction chamber and an ejection direction of the second fluid. The flushing member optionally provides a third fluid to flush the suction chamber and/or the first fluid pipeline.

Abstract: A long-effect self-cleaning negative-pressure ejector at least comprises a suction chamber, a jet pipe and a flushing member. A side wall of the suction chamber has at least one suction port for communicating with a first fluid pipeline. An exit port of the jet pipe is disposed in the suction chamber and ejects a second fluid so that a negative pressure is generated in the suction chamber, a first fluid in the first fluid pipeline obliquely enters the suction chamber, and a first included angle is between a direction in which the first fluid being sucked into the suction chamber and an ejection direction of the second fluid. The flushing member optionally provides a third fluid to flush the suction chamber and/or the first fluid pipeline. At least one air jet nozzle is disposed on the first fluid pipeline to inject gas into the first fluid pipeline.

Abstract: A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.

Abstract: An electrical discharge machining apparatus and an electrical discharge machining method with adjustable machining parameters comprise a carrier and an electrical discharge machining (EDM) unit. The carrier is used for placing a to-be-machined object defined with a machining target area. A discharge electrode of the electrical discharge machining (EDM) unit is used to cut the machining target area of the to-be-machined object along a first cutting direction with at least one machining parameter, the machining parameter is correspondingly adjusted when a specified parameter of the to-be-machined object changes to a first numerical value, thereby using the adjusted machining parameter to perform a second cutting step on the machining target area of the to-be-machined object. A segmented cutting technology for solving a problem that a cutting speed (mm2/min) is slowed down and a total cutting time is prolonged due to changes of the specified parameter of electrical discharge machining cutting.

Abstract: A non-contact processing device and a non-contact processing method are used to perform a processing procedure on a solid structure. The non-contact processing device of the invention uses an electromagnetic radiation source to provide energy to the solid structure to cause qualitative changes or defects in the solid structure, that is, to form a modified layer. A separation energy source is used to apply a separation energy on the solid structure with the modified layer in a non-contact manner. With stress, structural strength, lattice pattern or hardness of the modified layer being different from that of other non-processing areas, the solid structure can be rapidly separated or thinned at the modified layer.

Abstract: An electrical discharge machining apparatus comprises a carrier and an electrical discharge machining (EDM) unit. The carrier is provided with a jig comprising a carrier plate for carrying a to-be-machined object, and the to-be-machined object is defined with a machining target area. The electrical discharge machining (EDM) unit applies a discharge energy to the machining target area through a discharge electrode with a non-uniform electric field distribution, so that the electric field is concentrated on a traveling direction. The carrier plate has an adhesive layer capable of adhering and fixing the to-be-machined object, capable of avoiding jitter of the to-be-machined object during an electrical discharge machining procedure, and capable of avoiding burrs before an end of the electrical discharge machining procedure, and making the machining target area to be located above the carrier plate to be capable of preventing the jig from hindering the electrical discharge machining procedure.

Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

Abstract: A system for separation of gas and solid at least comprises a cyclone trapping device and a negative pressure waste gas treatment device. The cyclone trapping device has a gas inlet and outlet chamber and a cyclone separation chamber communicating with each other, and the gas inlet and outlet chamber has a gas inlet tube communicating with a process waste gas source and a gas outlet tube communicating with the negative pressure waste gas treatment device. A process waste gas generated by the process waste gas source is introduced into the gas inlet and outlet chamber through the gas inlet tube to generate cyclones, thereby separating a portion of solid particles from the process waste gas, and transmitting the process waste gas to the negative pressure waste gas treatment device through the gas outlet tube in order to further separate the remaining solid particles from the process waste gas.

Abstract: A sealing valve is disclosed. The valve comprises a valve seat, a power element and an elevation section. The valve seat is provided with through hole from front to rear, and the upper end of the valve seat is connected to a guiding body having a guiding slot and a directional slot. The power element is mounted at the upper end of the valve seat to control the elevating movement of the elevation section. The elevation section is downward extended to mount within a sealing element. The sealing element is driven to the through hole to seal the hole or to be driven away from the through hole, this avoid wearing within the valve seat in the course of sliding.

Abstract: A tube clip structure is disclosed.

Abstract: A pipe clip includes upper and lower clip members that are pivoted at one end and form upper and lower slots with a locking bar fixed in the lower slot. The upper and lower clip members form upper and lower grooves for receiving and thus engaging flanges of pipe sections to be jointed therein. A U-shaped pull tab has two limbs fit over and pivoted to the upper slot. An abutting block is fixed while rotating between the limbs and defines a through hole through which a stem of a hook-on member extends by sliding. The hook-on member has a hooked end engaged with the locking bar. A helical spring is fit over the stem and retained between the abutting block and a nut engaging a threaded end of the stem. The clip is efficiently installed by engaging the hooked end of the hook-on member with the locking bar and can be secured and released by pushing/pulling the pull tab. The pull tab is configured to causes deformation of the spring to induce a torque against release of the pull tab from the secured position.

Abstract: A vacuum valve is disclosed. The vacuum valve comprises a body and a cylinder, mounted at the upper end of the body having a cavity including a piston, the center of the piston provided a piston rod extended into the cavity and the two sides of the body and the bottom section of the body being air holes, characterized in that the end of the piston rod is connected with a rocking arm and a gate plate having a lug by means of a connection rod, and one side of the gate plate, positioned at the interior of the upper section of the air hole is a pivotal lug by means of a connection rod so that the valve plate is opened or closed at an arch angle at the air hole, and the exterior of the bottom section of the body is a bottom plate so that the vacuum valve is formed into a two-passages valve and is connectable to a 180 degree conduit.