Abstract: Disclosed are a semiconductor device and methods for manufacturing and inspecting the same. The manufacturing method comprises the steps of: providing at least one substrate; and performing a forming step for forming at least one microstructure on the substrate by utilizing a processing technique selected from a group consisting of a laser processing technique, a microwave processing technique, a radio frequency processing technique, an electrical discharge machining technique, a wet chemical processing technique, a mechanical processing technique, a plasma source processing technique, a particle beam processing technique, and a build-up processing technique. The microstructure is selected from the group consisting of a hole-shaped structure, a line structure, and an optical structure.

Abstract: A scanning acoustic microscope (SAM) apparatus and an operating system and platform thereof are provided. The SAM apparatus includes a platform for carrying at least one workpiece, a SAM having a detection probe, and at least one isolation element for causing an isolation state between the workpiece and a detection liquid. The operating system includes a control element configured to receive or formulate a custom path and drive the detection probe to scan according to the custom path. The platform includes a placing stage and a base defining a chamber therebetween. The detection liquid flows through the chamber to generate a negative pressure at the placing stage, thereby forming a suction force to adsorb the workpiece. The SAM apparatus provides ultrasonic waves via the detection probe that penetrate the detection liquid and the isolation element attached to the workpiece, thereby performing an ultrasonic scanning detection procedure on the workpiece.

Abstract: A gas purification system with a water tank, a reaction cavity, a condensation trap device and a dust collection chamber is disclosed. The reaction cavity uses a negative pressure suction to transport a water vapor and a gas to be processed into the reaction cavity, the gas to be processed at least contains a waste gas that can react with the water vapor, so that the water vapor contacts the waste gas in the gas to be processed and performs a reaction to obtain at least one product. The condensation trap device performs a condensation capture processing and a centrifugal separation processing on the product. The dust collection chamber is used to collect the product thrown out by centrifugal force and/or dropped by gravity.

Abstract: A dust-proof and vibration-proof cover with a covering element and a connecting element and a method of manufacturing the connecting element therefor are disclosed. The covering element is provided with a smooth curved surface, and at least a portion of the connecting element is provided with a continuous gradient change in a physical property between a first end and a second end. The first end of the connecting element is connected to a bottom surface of the covering element, the second end of the connecting element extends in a direction away from the covering element to be adjacent to a rotating shaft. The physical property of the portion of the connecting element adjacent to the first end matches the physical property of the covering element, and the physical property of the portion of the connecting element adjacent to the second end matches the physical property of the rotating shaft.

Abstract: A non-contact processing device and a non-contact processing method are used to perform a processing procedure on a solid structure. The non-contact processing device of the invention uses an electromagnetic radiation source to provide energy to the solid structure to cause qualitative changes or defects in the solid structure, that is, to form a modified layer. A separation energy source is used to apply a separation energy on the solid structure with the modified layer in a non-contact manner. With stress, structural strength, lattice pattern or hardness of the modified layer being different from that of other non-processing areas, the solid structure can be rapidly separated or thinned at the modified layer.

Abstract: Disclosed are a valve, a control method thereof, and a valve system. The valve is provided with a valve body and a valve disc, wherein the valve disc is driven by a pneumatic unit of the valve system to perform an operation within a chamber of the valve body. A gas is supplied to the pneumatic unit, such that the pneumatic unit controls the operation of the valve disc in a pneumatic manner according to gas parameter of the gas. Furthermore, the gas parameter provided to the pneumatic unit is adjusted to smooth the operation of the valve disc. The valve is optionally further provided with an actuation correction structure for preventing the valve disc from getting stuck.

Abstract: Disclosed are an electrical discharge machining apparatus and a method of the same used for performing an electrical discharge machining procedure on a to-be-machined object. The electrical discharge machining apparatus comprises a carrier and an electrical discharge machining unit. The electrical discharge machining unit performs the electrical discharge machining procedure on a machining target area of the to-be-machined object through an electrical discharge electrode with a machining parameter. The electrical discharge machining unit adjusts an actual output energy value correspondingly according to a changing status of an electrical discharge frequency or energy during an electrical discharge process of the electrical discharge machining procedure, so that the electrical discharge machining procedure maintains in a target machining status.

Abstract: Disclosed is a valve mechanism and an operating method of the same configured for optionally sealing or opening a first opening port on a cavity. The valve mechanism comprises a displacement element, a carrier plate, a sealing disc and a guide element. The displacement element drives the sealing disc to reciprocate via the carrier plate, and the guide element correspondingly guides an orientation of a sealing surface of the sealing disc according to an orientation of a sealing surface of the first opening port on the cavity when the sealing disc reciprocates, so that the sealing surface of the sealing disc is parallel to the sealing surface of the first opening port on the cavity, thereby symmetrically applying force to seal the first opening port on the cavity.

Abstract: An electrical discharge machining apparatus comprises a carrier and an electrical discharge machining (EDM) unit. The carrier is provided with a jig comprising a carrier plate for carrying a to-be-machined object, and the to-be-machined object is defined with a machining target area. The electrical discharge machining (EDM) unit applies a discharge energy to the machining target area through a discharge electrode with a non-uniform electric field distribution, so that the electric field is concentrated on a traveling direction. The carrier plate has an adhesive layer capable of adhering and fixing the to-be-machined object, capable of avoiding jitter of the to-be-machined object during an electrical discharge machining procedure, and capable of avoiding burrs before an end of the electrical discharge machining procedure, and making the machining target area to be located above the carrier plate to be capable of preventing the jig from hindering the electrical discharge machining procedure.

Abstract: Disclosed are a composite cleaning process and a composite cleaning system used for performing the composite cleaning process. The composite cleaning system comprises a carrier, a laser cleaning device, and a gas or liquid cleaning device. The carrier is used to carry at least one object, and the object has at least one to-be-cleaned target located on a to-be-cleaned area of the object. A composite cleaning step of the composite cleaning process comprises using the laser cleaning device to perform a laser reactive cleaning step on the to-be-cleaned area of the object and using the gas or liquid cleaning device to perform a gas or liquid reactive cleaning step on the to-be-cleaned area of the object. Thereby, either the laser reactive cleaning step or the gas or liquid reactive cleaning step is assisted by the other to improve a cleaning effect of the to-be-cleaned target.

Abstract: A system for separation of gas and solid at least comprises a cyclone trapping device and a negative pressure waste gas treatment device. The cyclone trapping device has a gas inlet and outlet chamber and a cyclone separation chamber communicating with each other, and the gas inlet and outlet chamber has a gas inlet tube communicating with a process waste gas source and a gas outlet tube communicating with the negative pressure waste gas treatment device. A process waste gas generated by the process waste gas source is introduced into the gas inlet and outlet chamber through the gas inlet tube to generate cyclones, thereby separating a portion of solid particles from the process waste gas, and transmitting the process waste gas to the negative pressure waste gas treatment device through the gas outlet tube in order to further separate the remaining solid particles from the process waste gas.

Abstract: A fast annealing equipment is applicable to the annealing treatment of silicon carbide wafers. The fast annealing equipment comprises a variable frequency microwave power source system, a resonant chamber heating system and a measurement and control system. The variable frequency microwave power source system uses a solid state power amplifier and has the flexibility of fast frequency sweep during heat treatment to compensate for resonant frequency changes due to load effect caused by temperature changes in a material to be annealed. In order to improve an energy efficiency and provide a sufficient microwave energy uniform area, the TM010 resonant chamber structure can be used to anneal 4-inch to 8-inch silicon carbide wafers. The measurement and control system combines software and hardware to form an automatic system with instant feedback to provide further flexibility, stability and reliability for the entire equipment.

Abstract: A self-cleaning negative-pressure ejector at least comprises a suction chamber, a jet pipe and a flushing member. A side wall of the suction chamber has at least one suction port for communicating with a first fluid pipeline. An exit port of the jet pipe is disposed in the suction chamber and ejects a second fluid so that a negative pressure is generated in the suction chamber, a first fluid in the first fluid pipeline enters the suction chamber, and a first included angle is between a direction in which the first fluid being sucked into the suction chamber and an ejection direction of the second fluid. The flushing member optionally provides a third fluid to flush the suction chamber and/or the first fluid pipeline.

Abstract: Disclosed are a laser-treated anti-deposition object with a main structure and a fluorine coating layer and a manufacturing method of the same. The fluorine coating layer covers a laser-treated surface of the main structure to form an anti-deposition surface, an initial surface of the main structure is subjected to a laser surface treatment step by a laser to become the laser-treated surface with a plurality of microstructures. The anti-deposition object contacts with a manufacturing process substance used or discharged during a manufacturing process performed by a manufacturing process equipment in a vacuum environment, and the anti-deposition surface of the object has a relatively high contact angle.

Abstract: Disclosed is an anti-deposition object for use in a vacuum environment with a main structure and a fluorine coating layer, the fluorine coating layer covers at least one surface of the main structure, the anti-deposition object contacts with a manufacturing process substance used or discharged during a manufacturing process performed by a manufacturing process equipment in the vacuum environment, the fluorine coating layer has a water droplet contact angle with the manufacturing process substance higher than that of the surface of the main structure, the fluorine coating layer has a hardness similar to or higher than that of the surface of the main structure, and the fluorine coating layer has a roughness lower than that of the surface of the main structure.

Abstract: Disclosed is an anti-deposition object with a main structure and a fluorine coating layer, the fluorine coating layer covers at least one surface of the main structure, the anti-deposition object contacts with a substance in an environment, the fluorine coating layer has a water droplet contact angle with the substance higher than that of the surface of the main structure, the fluorine coating layer has a hardness similar to or higher than that of the surface of the main structure, and the fluorine coating layer has a roughness lower than that of the surface of the main structure.

Abstract: Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.

Abstract: Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.

Abstract: Disclosed are a semiconductor waste gas treatment system and a moisture-gas separator of the same. A moisture-gas separator is communicated between a wet scrubber and an air extraction device in the semiconductor waste gas treatment system. An air inlet pipe, a separation pipe and an exhaust pipe are communicated with one another in the moisture-gas separator. A diversion inclined partition is disposed obliquely in the separation pipe and a filter material layer filled in the separation pipe of the moisture-gas separator. The wet scrubber washes a process waste gas from a process waste gas source and discharges a scrubbed waste gas. The air extraction device provides a suction force so that the scrubbed waste gas first enters the separation pipe through the air inlet pipe, and is separated into water mist and dust, and then a dry waste gas is discharged through the exhaust pipe.

Abstract: A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.