Patents Assigned to HIKARIBOND CO., LTD.
  • Publication number: 20100307679
    Abstract: The present adhesive for corrugated cardboard for preventing package stack crumbling is characterized by comprising a mixture of a petroleum resin emulsion containing a mineral oil and a water-soluble resin solution. Examples of the water-soluble resin include polyvinyl alcohol, sodium polyacrylate, carboxymethyl cellulose, hydroxyethyl cellulose, etc. The adhesive for corrugated cardboard is effecting for preventing package stack crumbling within a short period of drying time, and does not damage the surfaces of the corrugated cardboard when unpacking the package stack.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 9, 2010
    Applicants: HIKARIBOND CO., LTD., KANAE CHEMICALS CO., LTD., SHOWA HIGHPOLYMER CO., LTD.
    Inventors: Shigemitsu Yotsumoto, Toyohiko Fujii