Patents Assigned to HILL ENGINEERING, LLC
  • Patent number: 11906488
    Abstract: Analysis of residual stress in materials is often done in static conditions in a laboratory. Accurate systems and methods for performing these analyses in a dynamic, non-laboratory environment are notoriously difficult and can be very inaccurate. A method using a portable, field deployable apparatus having greater accuracy than currently available is disclosed whereby accurate and repeatable residual stress analysis may be implemented in non-laboratory environments leading to greatly improved diagnostics, maintenance and life limit prediction.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: February 20, 2024
    Assignee: HILL ENGINEERING, LLC
    Inventors: Adrian T. DeWald, Michael R. Hill, Eric Summer, Brett Watanabe, Teresa Wong
  • Patent number: 11609169
    Abstract: Analysis of residual stress in materials is often done in static conditions in a laboratory. Accurate systems and methods for performing these analyses in a dynamic, non-laboratory environment are notoriously difficult and can be very inaccurate. A method using a portable, field deployable apparatus having greater accuracy than currently available is disclosed whereby accurate and repeatable residual stress analysis may be implemented in non-laboratory environments leading to greatly improved diagnostics, maintenance and life limit prediction. Especially the analysis of a pipe or channel can be facilitated with this invention.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 21, 2023
    Assignee: HILL ENGINEERING, LLC
    Inventors: Adrian T. DeWald, Michael R. Hill, Teresa Wong, Brett Watanabe, Eric Summer
  • Patent number: 10900768
    Abstract: Analysis of residual stress in materials is often done in static conditions in a laboratory. Accurate systems and methods for performing these analyses in a dynamic, non-laboratory environment are notoriously difficult and can be very inaccurate. A method using a portable, field deployable apparatus having greater accuracy than currently available is disclosed whereby accurate and repeatable residual stress analysis may be implemented in non-laboratory environments leading to greatly improved diagnostics, maintenance and life limit prediction.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: January 26, 2021
    Assignee: HILL ENGINEERING, LLC
    Inventors: Adrian T. DeWald, Michael R. Hill, Eric Summer, Brett Watanabe, Teresa Wong