Abstract: A color filter including a substrate, a plurality of single film filter units and a plurality of multi-film filter units is provided. The substrate has a first region and a second region. The single-film filter units are respectively disposed on the substrate and within the first region. The multi-film filter units are respectively disposed on the substrate and within the second region. When a white beam is projected on the color filter, the single-film filter units and the multi-film filter units reflect a plurality of color beams. The multi-film filter units include a plurality of first multi-film filter units. When the white beam is projected on the first multi-film filter units, the first multi-film filter units reflect a first color beam.

Abstract: A semiconductor device including a substrate and at least one alignment mark disposed on the substrate and having at least one hollow pattern. Therefore, the identification rate of the alignment mark can be high by the hollow pattern.

Abstract: A semiconductor device including a substrate and at least one alignment mark disposed on the substrate and having at least one hollow pattern. Therefore, the identification rate of the alignment mark can be high by the hollow pattern.

Abstract: A method for manufacturing a color filter is provided. The method includes following steps. A substrate is provided. A first filter layer is formed on a first part of a first region and a first part of a second region of the substrate. A second filter layer is formed on a second part of the second region. A third filter layer is formed on a second part of the first region and a third part of the second region. When a white beam is projected on the color filter, the first region and the second region reflect a plurality of color beams. A color filter manufactured through the method is also provided.

Abstract: A micro-lens module including a first lens, a second lens, and an aperture stop is provided. The first lens is disposed between an object side and an image side, wherein a first surface of the first lens facing the object side is an aspheric surface, and the curvature radius of the aspheric surface is R1. The second lens is disposed between the first lens and the image side, wherein a second surface of the second lens facing the image side is an aspheric surface, and the curvature radius of the aspheric surface is R2. The aperture stop is disposed between the first lens and the second lens, wherein the distance from the first surface to the aperture stop is d1, and the distance from the second surface to the aperture stop is d2. The micro-lens module satisfies 6>d2/d1>2.5 and ?2.5<R1/R2<1.5.

Abstract: A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.

Abstract: A method for fabricating a back-side illumination image sensor includes: implanting a first type of dopant into an epitaxial layer disposed over a first side of a substrate layer to form a first dopant layer in a first side of the epitaxial layer; adhering a carry layer over the first dopant layer for carrying the substrate layer; grinding a second side of the substrate layer for exposing a second side of the epitaxial layer; implanting the first type of dopant into the epitaxial layer from the second side of the epitaxial layer to form a second dopant layer in the second side of the epitaxial layer; forming at least one metal layer over the second dopant layer after forming the second dopant layer in the second side of the epitaxial layer; removing the carry layer; and forming a color filtering module over the first dopant layer.

Abstract: The present invention provides a semiconductor device and a fabricating method thereof. The fabricating method comprises: providing a first substrate; forming a soft dry film having an adhesive film and a release film; sticking the soft dry film on the first substrate with the adhesive film; removing the release film; sticking a second substrate on the adhesive film; and heating the adhesive film to solidify the adhesive film to form a solid adhesive film. The semiconductor device comprises: a first substrate, a solid adhesive film, and a second substrate. The solid adhesive film is formed on the first substrate, and the second substrate is formed on the solid adhesive film.

Abstract: An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided.

Abstract: An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a lens barrel and a lens layer. The lens barrel is disposed on the image sensor and located in the light non-gathering region and has a through hole exposing a portion of the image sensor in the light gathering region. A material of the lens barrel includes a thermoplastic with a melting point higher than soldering temperature. The lens layer is disposed on an end portion of the lens barrel away from the image sensor and covers the through hole. The lens layer includes a glass substrate and a lens disposed on the glass substrate and located in the light gathering region.

Abstract: A fabricating method includes adhering an exposed surface of a first solid adhesive film to a first substrate. The second surface of the first solid adhesive film is exposed and adhered to a second substrate. A third substrate is adhered to a second substrate via a patterned second solid adhesive film, and a diaphragm layer is adhered to the third substrate via a patterned third solid adhesive film. A fourth solid adhesive film with a removable release film is adhered to the first substrate covered, followed by slicing to form wafer level lens modules.

Abstract: An optical system including a photo sensor, a wafer level optical (WLO) lens module and a focusing motor is provided. The WLO lens module is located at the photo sensor. The WLO lens module includes at least one transparent substrate and at least one lens, wherein the lens is disposed on the transparent substrate. The focusing motor is located between the WLO lens module and the photo sensor. The focusing motor drives the WLO lens module to move toward or backward the photo sensor.

Abstract: A micro-lens module including a first lens, a second lens, and an aperture stop is provided. The first lens is disposed between an object side and an image side, wherein a first surface of the first lens facing the object side is an aspheric surface, and the curvature radius of the aspheric surface is R1. The second lens is disposed between the first lens and the image side, wherein a second surface of the second lens facing the image side is an aspheric surface, and the curvature radius of the aspheric surface is R2. The aperture stop is disposed between the first lens and the second lens, wherein the distance from the first surface to the aperture stop is d1, and the distance from the second surface to the aperture stop is d2. The micro-lens module satisfies 6>d2/d1>2.5 and ?2.5<R1/R2<1.5.

Abstract: A method for manufacturing a color filter is provided. The method includes following steps. A substrate is provided. A first filter layer is formed on a first part of a first region and a first part of a second region of the substrate. A second filter layer is formed on a second part of the second region. A third filter layer is formed on a second part of the first region and a third part of the second region. When a white beam is projected on the color filter, the first region and the second region reflect a plurality of color beams. A color filter manufactured through the method is also provided.

Abstract: An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided.

Abstract: A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.

Abstract: A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.