Abstract: The disclosure provides a daisy-chain serial peripheral interface (SPI) integrated circuit (IC) and an operation method thereof. The daisy-chain SPI IC includes a first MISO interface circuit, a second MISO interface circuit, a first data enable (DE) interface circuit, and a second DE interface circuit. When the daisy-chain SPI IC is a target slave circuit selected by a master IC for reading target data, the first DE interface circuit outputs a DE signal to the master IC, and the first MISO interface circuit sends back the target data to the master IC based on the timing of the DE signal. When the daisy-chain SPI IC is not the target slave circuit, the signal received by the second DE interface circuit is transmitted to the first DE interface circuit, and the data received by the second MISO interface circuit is transmitted to the first MISO interface circuit.

Abstract: The invention provides a large touch display integrated (LTDI) circuit and an operation method thereof. The LTDI circuit is suitable as a slave IC of an serial peripheral interface (SPI) architecture. The LTDI circuit includes an open-drain circuit and a reload circuit. An output terminal of the open-drain circuit is configured to be coupled to a correctness wire outside the LTDI circuit. The correctness wire is also coupled to an input terminal of a master IC of the SPI architecture, and a potential of the correctness wire is pulled up by a pull-up resistor. The reload circuit is coupled to an input terminal of the open-drain circuit. The reload circuit is configured to check a correctness of a boot up code from the master IC to generate a correctness check result. The reload circuit returns the correctness check result to the master IC via the open-drain circuit and the correctness wire.

Abstract: A serial peripheral interface (SPI) integrated circuit (IC) and an operation method thereof are provided. A SPI architecture includes a master IC and a slave IC. When the SPI IC is a master IC, the SPI IC generates first command information for a slave IC, generates first debugging information corresponding to the first command information, and sends the first command information and the first debugging information to the slave IC through a SPI channel. When the SPI IC is the slave IC, the SPI IC receives second command information and second debugging information sent by the master IC through the SPI channel and checks the second command information by using the second debugging information. When the SPI IC is a target slave circuit selected by the master IC, the SPI IC executes the second command information under a condition that the second command information is checked and is correct.

Abstract: A multi-level voltage generator includes P-type metal-oxide-semiconductor (PMOS) transistors that generate corresponding positive voltages and a common voltage respectively, each PMOS transistor having a source connected to corresponding generated voltage, and a drain connected to an output node to provide the corresponding generated voltage; N-type metal-oxide-semiconductor (NMOS) transistors that generate corresponding negative voltages and the common voltage respectively, each NMOS transistor having a source connected to corresponding generated voltage, and a drain connected to the output node to provide the corresponding generated voltage; and body-voltage selectors that adaptively select a body voltage for the plurality of PMOS transistors and NMOS transistors respectively, except PMOS transistor associated with a highest positive voltage and NMOS transistor associated with a lowest negative voltage with body and source connected together.

Abstract: A micro-light-emitting diode (microLED) display panel includes a timing controller, and a plurality of drivers controlled by the timing controller and arranged in an order according to distance from the timing controller. Each driver includes a buffer that buffers a signal before being sent to a succeeding driver.

Abstract: An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

Abstract: The optical component includes a first substrate, a first diffractive layer formed on the first substrate, a second substrate, a second diffractive layer formed on the second substrate, and a bonding material disposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. The second diffractive layer is disposed opposite to the first diffractive layer, and both the first diffractive layer and the second diffractive layer are located between the first substrate and the second substrate. A gap is formed between the first diffractive layer and the second diffractive layer.

Abstract: A timing controller circuit is arranged to control at least a gate in panel (GIP) circuit in a display panel, and includes a data receiving circuit, a timing detection circuit, a control circuit, and a data transmitting circuit, wherein the data receiving circuit is arranged to receive an image data, the timing detection circuit is coupled to the data receiving circuit, and is arranged to detect an input timing of the image data, the control circuit is coupled to the timing detection circuit, and is arranged to determine a GIP timing of the GIP circuit according to the input timing of the image data, and generate a timing control output according to the GIP timing, and the data transmitting circuit is coupled to the control circuit, and is arranged to transmit the timing control output to the GIP circuit.

Abstract: A waveguide combiner includes an in-coupling area, a waveguide body and an out-coupling area. The in-coupling area is configured to introduce a light beam. The waveguide body is configured to guide the light beam introduced by the in-coupling area. The out-coupling area is configured to output the light beam guided by the waveguide body. The waveguide body includes at least one of a beam-expanding part configured to expand the light beam to a predetermined direction by reflecting the light beam and a beam-folding part configured to change the light beam to a different direction by reflecting the light beam.

Abstract: A touch controller coupled to a touch sensor panel and arranged to detect touch events on the touch sensor panel includes a sensing circuit. The sensing circuit includes an integrator circuit and a reference voltage controlling circuit. The integrator circuit includes a first input node coupled to a sensing node for receiving a sensing signal, a second input node coupled to a guard trace disposed adjacent to the touch sensor panel and an output node outputting an integrated signal. The reference voltage controlling circuit includes a switch coupled between the second input node of the integrator circuit and a voltage source providing a reference voltage. The switch is closed during a pre-charge period to charge a voltage on the guard trace to the reference voltage in beginning of a sensing period and is opened after the pre-charge period.

Abstract: A touch event processing circuit includes a plurality of receiving circuits and an average circuit. Each of the plurality of receiving circuits includes a first integrator circuit, a resistor, and a touch event detection circuit. The first integrator circuit is arranged to receive an input signal that includes a voltage sensing signal from a touch panel, and output a first integrated voltage signal. The resistor has a first terminal coupled to an output terminal of the first integrator circuit and a second terminal. The touch event detection circuit is arranged to detect a touch event according to the output from the second terminal of the resistor and a voltage average signal. The average circuit is arranged to: receive a plurality of first integrated voltage signals from the plurality of receiving circuits; and perform an average operation upon the plurality of first integrated voltage signals, to generate the voltage average signal.

Abstract: A display system includes an image display device and a pair of shutter glasses. The image display device includes a display panel, a display communication circuit and a control circuit. The control circuit is configured to control the display communication circuit to transmit a shutter glasses control signal, and configured to control the display panel to alternately display a normal image and a compensate image according to a timing control signal. The pair of shutter glasses includes a pair of shutters, a glasses communication circuit and a shutter control circuit. The glasses communication circuit is configured to receive the shutter glasses control signal. The shutter control circuit is configured to alternately open and close the pair of shutters according to the shutter glasses control signal.

Abstract: An object detection method, for detecting a target object, comprising: capturing at least two detection portions with a first aspect ratio from an input image with a second aspect ratio; confirming whether any object is detected in each of the detection portions and obtaining corresponding boundary boxes for detected objects; and wherein the first aspect ratio is different to the second aspect ratio.

Abstract: An imprinting apparatus includes an imprinting platform, an imprinting roller, a transfer module and a lifting and pressing mechanism. The imprinting roller is disposed above the imprinting platform. The transfer module includes a transfer film, wherein the transfer film is located between the imprinting roller and the imprinting platform. The lifting and pressing mechanism is linked with the imprinting roller, wherein the lifting and pressing mechanism drives the imprinting roller to move along a normal direction of the imprinting platform and selectively pressurizes the imprinting roller.

Abstract: A motion detection method includes providing a buffer including a first buffer associated with a background image and a second buffer associated with a foreground image; checking first similarity between the gray level of an input pixel and the first gray level of the first buffer; determining the input pixel as a still pixel if the first similarity is true; checking second similarity between the gray level and the second gray level of the second buffer; determining the input pixel as a moving pixel if the second similarity is false; determining the input pixel as the moving pixel if the second count value is less than the first count value; and determining the input pixel as the still pixel and swapping the first buffer with the second buffer, if the second count value is not less than the first count value.

Abstract: A process of overlay offset measurement includes providing a substrate; forming a first pattern layer with a predetermined first pattern on the substrate; forming a first photoresist layer on the substrate and the first pattern layer; forming a second photoresist layer on the first photoresist layer; forming a second pattern layer with a predetermined second pattern on the second photoresist layer; patterning the second photoresist layer to form a trench having a predetermined third pattern being substantially aligned with the predetermined first pattern of the first pattern layer; and performing overlay offset measurement according to the second pattern layer and the trench.

Abstract: A waveguide combiner includes an in-coupling area, a waveguide body, an out-coupling area and at least one film layer. The in-coupling area is configured to introduce a light beam. The waveguide body is configured to guide the light beam introduced by the in-coupling area. The out-coupling area is configured to output the light beam guided by the waveguide body. Said at least one film layer is embedded in at least one portion of the in-coupling area, the waveguide body and the out-coupling area. Said at least one film layer is configured to divide said at least one portion of the in-coupling area, the waveguide body and the out-coupling area into a plurality of layers, and the light beam is reflected by said at least one film layer or penetrates said at least one film layer between different layers of the plurality of layers.

Abstract: A clock and data recovery circuit includes a voltage controlled oscillator, a frequency detector and a control circuit. The voltage controlled oscillator is configured to generate a clock signal according to a voltage signal. The frequency detector is configured to detect whether increasing a frequency of the clock signal is required according to a plurality of sampling results of the input data signal and accordingly generate a first up control signal. The control circuit is coupled to the voltage controlled oscillator and the frequency detector and configured to adjust the voltage signal according to the first up control signal. The clock and data recovery circuit operates in a data recovery mode after detecting that the frequency of the clock signal is locked, and the frequency detector is configured to detect whether increasing the frequency of the clock signal is required in the data recovery mode.

Abstract: A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.

Abstract: The present invention provides a projector including a laser module and a lens module, wherein the lens module includes a plurality of lens and a plurality of diffractive optical elements. In the operations of the projector, the laser module is arranged to generate at least one laser beam; each of the lenses is arranged to receive one of the at least one laser beam to generate a collimated laser beam; and the diffractive optical elements correspond to the lenses, respectively, and each of the diffractive optical elements is arranged to receive the collimated laser beam from the corresponding lens to generate an image. The images generated by the diffractive optical elements form a projected image of the projector. By using the projector of the present invention, the projected image may have higher resolution or field of view that is advantageous for the 3D sensing system.