Abstract: A substrate heating device is provided. The substrate heating device includes a vacuum chamber and a heater. The vacuum chamber receives a substrate. The heater includes a body, a heating wire, and a terminal part. The body penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber. The heating wire is provided inside the body and partly disposed inside the vacuum chamber. The terminal part is connected to the heating wire and is disposed outside the vacuum chamber.
Type:
Grant
Filed:
June 4, 2020
Date of Patent:
September 5, 2023
Assignees:
NISSIN ION EQUIPMENT CO., LTD., HIMEJI RIKA CO., LTD.
Abstract: A substrate heating device is provided. The substrate heating device includes a vacuum chamber and a heater. The vacuum chamber receives a substrate. The heater includes a body, a heating wire, and a terminal part. The body penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber. The heating wire is provided inside the body and partly disposed inside the vacuum chamber. The terminal part is connected to the heating wire and is disposed outside the vacuum chamber.
Type:
Application
Filed:
June 4, 2020
Publication date:
December 31, 2020
Applicants:
NISSIN ION EQUIPMENT CO., LTD., HIMEJI RIKA CO., LTD.