Patents Assigned to HIMEJI RIKA CO., LTD.
  • Publication number: 20200413493
    Abstract: A substrate heating device is provided. The substrate heating device includes a vacuum chamber and a heater. The vacuum chamber receives a substrate. The heater includes a body, a heating wire, and a terminal part. The body penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber. The heating wire is provided inside the body and partly disposed inside the vacuum chamber. The terminal part is connected to the heating wire and is disposed outside the vacuum chamber.
    Type: Application
    Filed: June 4, 2020
    Publication date: December 31, 2020
    Applicants: NISSIN ION EQUIPMENT CO., LTD., HIMEJI RIKA CO., LTD.
    Inventors: Masatoshi ONODA, Ryosuke GOTO, Kazuo SHIMIZU, Yasuhiro KISHIMOTO