Patents Assigned to HIMEJI TOSHIBA E.P. CORPORATION
  • Lead frame and electronic component using same
    Publication number: 20040183168
    Abstract: Disclosed are a lead frame and an electronic component using such a lead frame. In order to both assure reliability and reduce costs, the lead frame of the present invention comprises a plate-like disk part on which a chip which is a main body of an electronic component is mounted, and a plate-like lead part formed thinner than the disk part and functioning as an electrical external connecting terminal of the electronic component, wherein the disk part and the lead part are joined together by means of ultrasonic welding.
    Type: Application
    Filed: December 30, 2003
    Publication date: September 23, 2004
    Applicant: HIMEJI TOSHIBA E.P. CORPORATION
    Inventors: Tadashi Miyamoto, Yoshihiro Uekawa, Kenichi Asada, Shigeaki Sugawara