Abstract: The present invention provides a multi-chamber plasma processing system. A load lock chamber having an atmospheric gate valve and a vacuum gate valve is operatively connected to a transport chamber through the vacuum gate valve. A process chamber is mounted on the load lock chamber wherein the process chamber has only one gate valve that is positioned between the transport chamber and the process chamber. The process chamber does not have an atmospheric gate valve. A substrate handling robot is mounted within the transport chamber and operatively communicates with the load lock chamber through the vacuum gate valve and operatively communicates with the process chamber through the only gate valve of the process chamber.

Abstract: The present invention provides a method for detecting Anomalous Substrates in Automated Material-Handling Systems comprising the following steps. A substrate cassette having at least one substrate is provided. The substrate cassette is positioned within the material handling system. Each substrate has a top surface and a bottom surface. A first beam is emitted from a first emitter wherein the first beam is in optical communication with the top surface of the substrate. A second beam is emitted from a second emitter wherein the second beam is in optical communication with the bottom surface of the substrate. The first beam and the second beam are detected using at least one detector.