Patents Assigned to Hiroshima Co., Ltd.
  • Patent number: 11717920
    Abstract: A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: August 8, 2023
    Assignees: Panasonic Intellectual Property Management Co., Ltd., HIROSHIMA CO., LTD.
    Inventors: Kosuke Inoue, Yuji Kaede, Shu Kumamoto, Hideaki Kunieda
  • Publication number: 20220080537
    Abstract: A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.
    Type: Application
    Filed: July 19, 2021
    Publication date: March 17, 2022
    Applicants: Panasonic Intellectual Property Management Co., Ltd., Hiroshima Co., Ltd.
    Inventors: Kosuke INOUE, Yuji KAEDE, Shu KUMAMOTO, Hideaki KUNIEDA