Patents Assigned to Hiroshima Co., Ltd.
  • Patent number: 11717920
    Abstract: A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: August 8, 2023
    Assignees: Panasonic Intellectual Property Management Co., Ltd., HIROSHIMA CO., LTD.
    Inventors: Kosuke Inoue, Yuji Kaede, Shu Kumamoto, Hideaki Kunieda
  • Publication number: 20220080537
    Abstract: A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.
    Type: Application
    Filed: July 19, 2021
    Publication date: March 17, 2022
    Applicants: Panasonic Intellectual Property Management Co., Ltd., Hiroshima Co., Ltd.
    Inventors: Kosuke INOUE, Yuji KAEDE, Shu KUMAMOTO, Hideaki KUNIEDA
  • Patent number: 7078517
    Abstract: It is intended to provide a method of reusing a DNA-immobilization substrate whereby the expensive DNA-immobilization substrate can be efficiently utilized and a reusable DNA-immobilization substrate having the same performance as a new product without any trouble in practical use can be provided. Namely, a method of reusing a DNA-immobilization substrate characterized in that, to remove DNA from a DNA-immobilization substrate carrying the DNA immobilized by an acid-amide bond via an oligonucleotide to thereby enable the immobilization of a fresh DNA, the acid-amide bond between the substrate and the DNA is hydrolyzed with an acid or an alkali.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: July 18, 2006
    Assignees: Toyo Kohan Co., LTD, Nihon Parrkerizing Hiroshima Co., LTD
    Inventors: Kojiro Takahashi, Osamu Takai, Michifumi Tanga
  • Patent number: 7029881
    Abstract: Method and apparatus for constructing a cDNA library by hybridizing mRNA with oligo (dT) on a support and treating with a reverse transcriptase to immobilized complementary DNA, or for constructing a gDNA library by ligating a double-stranded chromosomal DNA library with an oligonucleotide on a support having a restriction enzyme site and then immobilizing the gDNA library.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: April 18, 2006
    Assignees: Nihon Parkerizing Hiroshima Co., Ltd., Toyo Kohan Co., Ltd.
    Inventors: Kojiro Takahashi, Osamu Takai, Michifumi Tanga