Patents Assigned to HIRSCHBERG ENGINEERING AG
  • Patent number: 11772065
    Abstract: A device is provided having a structure for conducting a first fluid, the structure having in addition an interface for conducting a second fluid. The first fluid can be brought into contact with the second fluid at the interface of the structure. A flow interrupter (120.0) for interrupting a flow of the second fluid is situated at the interface of the structure.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: October 3, 2023
    Assignee: Hirschberg Engineering AG
    Inventor: Sebastian Hirschberg
  • Publication number: 20220297081
    Abstract: A device is provided having a structure for conducting a first fluid, the structure having in addition an interface for conducting a second fluid. The first fluid can be brought into contact with the second fluid at the interface of the structure. A flow interrupter (120.0) for interrupting a flow of the second fluid is situated at the interface of the structure.
    Type: Application
    Filed: June 3, 2022
    Publication date: September 22, 2022
    Applicant: Hirschberg Engineering AG
    Inventor: Sebastian Hirschberg
  • Patent number: 11369939
    Abstract: A device is provided having a structure for conducting a first fluid, the structure having in addition an interface for conducting a second fluid. The first fluid can be brought into contact with the second fluid at the interface of the structure. A flow interrupter (120.0) for interrupting a flow of the second fluid is situated at the interface of the structure.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: June 28, 2022
    Assignee: Hirschberg Engineering AG
    Inventor: Sebastian Hirschberg
  • Patent number: 11155027
    Abstract: The invention relates to a method for manufacturing molded articles consisting of at least one molded article layer, said method comprising the steps of a) putting a layer support in place for accommodating at least one molded article layer; b) applying a molded article layer to a printing plate using a shaping tool; c) positioning the printing plate and the layer support or a previously produced molded article layer relative to one another; d) curing the molded article layer such that said layer becomes a previously molded article layer, and transferring the molded article layer; e) if necessary, putting the printing plate in place for accommodating additional molded article layers and repeating steps b) to d). The invention further relates to an apparatus for carrying out the disclosed method as well as to the use of molded articles obtained thereby.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: October 26, 2021
    Assignee: HIRSCHBERG ENGINEERING AG
    Inventor: Sebastian Hirschberg