Patents Assigned to HiSOL, Inc.
  • Chuck unit and method for controlling temperature of the chuck unit
    Patent number: 11486895
    Abstract: A chuck unit includes a chuck on which a semiconductor is mounted, a heating part including a heater and configured to heat the chuck, a cooling block configured to cool the heating part by using fluid-cooling, and a Peltier module configured to cool the cooling block. The heater is configured to be energized while the cooling block and the Peltier module are spaced apart from each other, and the heater is configured to be cut off from energization while the cooling block and the Peltier module contact each other.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: November 1, 2022
    Assignee: HiSOL, Inc.
    Inventor: Hirofumi Yanai