Abstract: For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate.

Abstract: A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

Abstract: An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.

Abstract: An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7′), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc.

Abstract: In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.

Abstract: A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.