Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
Abstract: Provided is an antenna device including a substrate, a metal chassis disposed adjacent a rear surface of the substrate, multiple patch antenna elements formed in an array on a front surface of the substrate, feeding lines formed on the front surface of the substrate and through which electricity is fed to the multiple patch antenna elements, and a ground conductor formed on the rear surface of the substrate in a portion opposite the feeding lines.
Abstract: Problem There is proposed an innovative cross-sectional structure, with an idea contrary to the conventional one, utilizing the non-reactivity between Cu and Ta (or between Ag and Nb, Ta) in a high-temperature short-time heat treatment, thus achieving (1) the suppression of the low magnetic-field instability, (2) excellent wire drawability of a precursor wire, and (3) the reduction of the cost required for the incorporation of a stabilizer. Means for Resolution There is proposed a structure having an assembly of a plurality of single wires, wherein the assembly is covered with an outer cover (skin) formed from Nb or Ta, wherein each of the single wires has an Nb/Al composite filament region which is formed from a composite of Nb and Al mixed in an Nb:Al molar ratio of 3:1, and which is covered with a partition formed from Nb or Ta, and further covered with an interfilamentary barrier formed from Cu or Ag disposed around the partition.
November 15, 2012
December 3, 2015
HITACHI CABLE, LTD., NATIONAL INSTITUTE FOR MATERIALS SCIENCE, INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION
Hitachi Cable, Ltd., Inter-University Research Institute Corporation, National Institute For Materials Science
Abstract: The invention provides a coaxial cable including an internal insulating layer formed on an outer periphery of an electric conductor, a conductive layer formed on an outer periphery of the internal insulating layer, and an external insulating layer formed on an outer periphery of the conductive layer. The conductive layer is made of a metal nanoparticle paste sintered body obtained by sintering metal nanoparticles by irradiation of light toward a metal nanoparticles paste.
June 12, 2009
Date of Patent:
August 26, 2014
Hitachi Cable, Ltd.
Tomiya Abe, Dai Ishikawa, Masanobu Ito, Tadayoshi Tsuchiya
Abstract: A catheter wire includes a core bundle formed by twisting a plurality of core wires each including a solid conductor covered with an insulation, a tape layer formed by spirally winding a binding tape on an outer periphery of the core bundle, a shield layer formed by spirally winding a metal wire on an outer periphery of the tape layer, and a sheath layer formed on an outer periphery of the shield layer. The binding tape is wound in a direction opposite to a twisting direction of the core wires. The solid conductor and the metal wire have a tensile strength of not less than 900 MPa and an elongation percentage of not more than 2%.
Abstract: A catheter wire includes a wire core including a semi-rigid stainless steel, and a conductor layer covering an outer periphery of the wire core. A method of manufacturing a catheter wire includes drawing a stainless steel in an axial direction so as to form a wire core with a predetermined diameter, annealing the drawn stainless steel so as to change the stainless steel into a semi-rigid stainless steel, and forming a conductor layer on an outer periphery of the semi-rigid stainless steel.
Abstract: A method is for producing an electrode terminal connector for electrically connecting together a positive and a negative terminal formed of mutually dissimilar metals respectively. The method includes the steps of pressing a thin plate formed of a similar metal to the positive terminal to form a mounting hole in the thin plate, pressing a thick plate formed of a similar metal to the negative terminal to form a metallic member which is smaller in diameter than the mounting hole, and inserting the metallic member into the mounting hole and flattening the metallic member in the mounting hole to widen the mounting hole and join the thin plate and the metallic member together. The steps are continuously performed by a pressing device.
Abstract: A method is for producing an electrode terminal connector for electrically connecting together a positive terminal and a negative terminal of mutually dissimilar metals. The method includes pressing a first plate of a similar metal to the positive terminal to form a mounting hole in the first plate, pressing a second plate of a similar metal to the negative terminal to form a metallic member which is larger in diameter than the mounting hole, and inserting the metallic member into the mounting hole by press fitting to join the first plate and the metallic member together. The method further includes providing the metallic member with an intervening layer of metal having an ionization tendency between an ionization tendency of metal constituting the first plate and an ionization tendency of metal constituting the second plate, and the first plate and the metallic member are joined together via the intervening layer.
Abstract: A shielded cable includes a twisted cable including a plurality of electric wires each including a conductor covered with an insulation therearound, and an electrically conductive wire twisted together with the plurality of electric wires, and a strip-like member including a conductive layer and an insulating layer. The strip-like member is wound around the twisted cable in the same direction as a twist direction of the twisted cable and at substantially the same winding pitch as a twist pitch of the twisted cable such that the conductive layer is continuously contacted with and along the lead wire.
Abstract: Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either.
Abstract: A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions.
Abstract: An oil-cooled equipment harness includes a front end to be enclosed in a shielding case of an oil-cooled equipment for connecting to a terminal of a body of the oil-cooled equipment disposed in the shielding case, a wire including a conductor, a sheath including an insulating elastic member on a periphery side of the conductor, and a flexibility, a terminal fitting enclosing a portion of the conductor and a portion of the sheath of the wire, connecting to the conductor, and connecting to the terminal of the body of the oil-cooled equipment, a housing attached to shielding case and enclosing a periphery of the wire a predetermined distance away from the terminal fitting such that the wire is exposed from the terminal fitting, and an oil entry-preventing unit disposed between the wire and the terminal fitting for preventing oil in the shielding case from entering into the conductor.
Abstract: Outer-conductor-exposed portions are positioned in respective second body portions of a cable holder, and solder is supplied into solder pools provided in the respective second body portions, whereby outer conductors and ground contacts are connected to each other. Hence, even if the solder is in a molten state, a heated soldering bit does not touch the outer conductors. Therefore, the occurrence of any deformation or melting of insulators is suppressed. Furthermore, since there is no need to caulk any shield connection terminals in such a manner as to conform to the shapes of the outer conductors as in the known art, there is no chance of the insulators undergoing elastic deformation. Hence, the insulators are protected from any factors for thermal deformation and elastic deformation, and electric characteristics of differential signal transmission cables for individual finished products are thus stabilized. Consequently, the reliability of the cable assembly is improved.
Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.
Abstract: The invention provides a method for manufacturing a Group III nitride semiconductor crystal. The method includes the steps of preparing a seed crystal and performing a convex surface-growing step to grow the group III nitride semiconductor crystal. The growth surface of the group III nitride semiconductor crystal is constituted only by a plurality of surfaces not vertical to a growth direction and the group III nitride semiconductor crystal grows while forming a convex shape as a whole by the growth surface constituted of the plurality of surfaces. The invention also provides a method for manufacturing a group III nitride semiconductor substrate.
Abstract: A cable condition monitoring device for monitoring a damaged condition of a cable including a conductor part including a plurality of element wires and an insulating material part formed on a periphery of the conductor part includes a gas feeding device configured to feed a compressed gas into the conductor part, a pressure gauge configured to measure a pressure in the conductor part, and an insulating material part damage judgment part configured to judge whether the insulating material part is damaged or not based on the pressure measured by the pressure gauge.
Abstract: A differential signal transmission cable includes first and second signal lines arranged parallel to each other, a conductive layer made of a conductor in which a current is induced when signals propagate through the first and second signal lines, and a dielectric disposed between the first and second signal lines and the conductive layer. The conductive layer has a signal attenuating structure including a non-continuous section in which the conductor is non-continuous, the non-continuous section being located such that, among differential signal components and common-mode signal components included in the signals propagating through the first and second signal lines, the common-mode signal components are attenuated by an attenuation factor greater than an attenuation factor of the differential signal components.
Abstract: An optical board includes a plate-shaped resin base material including a slit-shaped optical fiber housing portion formed thereon, a metal layer formed on a surface of the based material, and a reflective layer for reflecting light propagating in an optical fiber housed in the optical fiber housing portion. The base material further includes an inclined surface inclined with respect to the surface of the base material at a terminal end of the optical fiber housing portion. The reflective layer is formed over an end face of the metal layer and the inclined surface, the end face forming a flat surface continuously with the inclined surface.
Abstract: A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.
January 23, 2012
Date of Patent:
April 15, 2014
Hitachi Cable, Ltd.
Kouki Hirano, Hiroki Yasuda, Yoshinori Sunaga, Shohei Hata
Abstract: A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 ?m.