Abstract: A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible resin film. When the substrates are laminated, the lower substrate 6 on one hand is aligned to the upper substrate 7 on the other hand in every arbitrary length. With this arrangement, productivity can be improved as well as a positional dislocation due to accumulation of positioning errors can be prevented.

Abstract: A host's immune function can be characterized by quantifying changes in offensive and defensive immune function associated markers. Certain methods can be used to identify a potentially efficacious therapy for a subject based on the induction of expression of offensive and defensive immune function-associated markers. Additionally, some methods can be used to identify drugs that allow the stimulation of either the offensive or defensive immune response while inhibiting the other of offensive or defensive immune response.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100, each having external electrodes formed on a pair of opposing surfaces. One 102 of the electrodes is arranged on an antenna circuit 201 in a transmission/reception antenna having a slit. Furthermore, a bridging plate 300 is arranged for separately and electrically connecting the other external electrode 103 to a predetermined position of the corresponding antenna circuit 301. The method is characterized in that by positioning at least one of the IC chips 100 with the predetermined position on the corresponding antenna circuit 201 to be mounted, it is possible to arrange the retraining IC chips 100 at the predetermined positions on the antenna circuit 201 all at once.

Abstract: Provided herein are primer/probe sets useful for detecting HIV (HIV-1) in a test sample. The primer/probe sets can be employed according to nucleic acid amplification procedures including PCR, real-time quantitative PCR, or RT-PCR. The primer/probe sets can also be provided in the form of a kit with other reagents for performing a nucleic acid amplification reaction.

Abstract: A method for predicting patient responsiveness to rheumatoid arthritis treatments involving altering expression of tumor necrosis factor superfamily (“TNFSF”)-2, TNFSF-8, or TNFSF-15 is disclosed. A method for monitoring the effectiveness of such therapy is also disclosed. Furthermore, a method of screening compounds for use in the treatment of rheumatoid arthritis is disclosed. A method of monitoring the disease state over time in rheumatoid arthritis patients is also disclosed.

Abstract: A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64).

Abstract: Objects of the present invention are to provide a purification process that enables Pd and P to be removed effectively, and to provide an electroluminescent material and an electroluminescent device obtained by employing the process. The present invention relates to a process for purifying an electroluminescent material, the process involving treating, with an oxidizing agent and then with a column, an electroluminescent material that contains Pd and/or P as impurities so as to remove the Pd and/or P.

Abstract: The present invention is directed to a CMP polishing slurry comprising cerium oxide particles, an organic compound having an acetylene bond (triple bond between carbon and carbon) and water, and a method for polishing a substrate which comprises a step of polishing a film to be polished of the substrate with the polishing slurry. In a CMP (chemical mechanical polishing) technique for flattening inter layer dielectrics, insulating films for shallow trench isolation and the like in a manufacturing process of semiconductor devices, the present invention enables the effective and high-speed polishing.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: A tubular container enabling individual identification, suitable to store semen of a domestic animal or a small amount of an organism individual sample and to manage history information, excellent in reliability, workability, and communication characteristics, and incorporating an IC tag. The tubular container is composed of a resin tubular container, a sealing cap, an IC tag embedded in the sealing cap and composed of an IC chip and a first transmitting/receiving antenna, and a second transmitting/receiving antenna fixed to the tubular container.

Abstract: A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element.

Abstract: A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied. (i): The proportion of the content of the component (A) with respect to the content of the component (C) is 2.00 or greater. (ii): It further comprises (G) at least one kind selected from among organic acids and their acid anhydrides.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: Disclosed is an information processing device with lighting function that realizes reduced power consumption and cost reductions. The optical connecting member 17 flexibly connects between a light guide plate 14 of a displaying part side and a light guide plate 21 of a key operating part side, thereby guiding light emitted from a white light LED 13 of a displaying part side to key operating part side.

Abstract: A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an even thickness to a dielectric substrate (2a), the metallic spacer (7a) having dimensions E1 and E2 of cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer (7b) having substantially equal dimensions to the metallic spacer (7a), to sandwich the film substrate (4) in between, and in addition, an upper ground conductor (5) is arranged on the other metallic spacer (7b), and a quadrate resonant patch pattern (8) is formed at an end of the strip line conductor (3) formed to the film subs ate (4), on an area corresponding to a transducer end of the waveguide (6), while a combination of the quadrate resonant patch pattern (8) and the waveguide (6) is arranged such that the qu

Abstract: A back light device realizing improvement in hotspots and bright line in the region of light incidence and of darkness arising in between light sources is provided by forming the reflective surface of the reflector as a structured face comprising an iteration of prism elements of trapezoidal section.

Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefore easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.

Abstract: The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition.