Abstract: Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.

Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

Abstract: The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer. Capable of being provided are an optical waveguide and an optoelectronic circuit board each having a simple configuration in which an optical device is not mounted on an optical wiring part or an optoelectronic composite wiring part and capable of connecting an optical device with a core of an optical waveguide in an optical wiring part (optical waveguide) or an optoelectronic composite wiring part (optoelectronic circuit board) at a high position accuracy and an optical module comprising an optical waveguide or an optoelectronic circuit board and a connector.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: A method for electrically connecting a surface electrode of a solar battery cell and a wiring member via a conductive adhesive film, wherein the conductive adhesive film contains an insulating adhesive and conductive particles, and wherein when the ten point height of roughness profile and maximum height of the surface of the surface electrode in contact with the conductive adhesive film are Rz (?m) and Ry (?m) respectively, the average particle diameter r (?m) of the conductive particles is equal to or greater than the ten point height of roughness profile Rz, and the thickness t (?m) of the conductive adhesive film is equal to or greater than the maximum height Ry.

Abstract: A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.

Abstract: A thermoelectric material (and a method for producing the same) is essentially formed of an Mg2Si-based compound represented by the chemical formula Mg2-x-y-zAlxZnyMnzSi (x?0, y?0, z?0, 0.04?y/x?0.6, and 0.013?z/x?0.075) wherein the total amount of Al, Zn, and Mn is 0.3 at % to 5 at %. Mg2-x-y-zAlxZnyMnz is provided in the form of an Mg alloy.

Abstract: Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

Abstract: The present invention relates to a method for producing carbon nanotubes, comprising a synthesis step of synthesizing carbon nanotubes on a support on which a catalyst is supported by flowing a source gas consisting of acetylene, carbon dioxide, and an inert gas over the support, wherein in the source gas, a partial pressure of the acetylene is 1.33×101 to 1.33×104 Pa, a partial pressure of the carbon dioxide is 1.33×101 to 1.33×104 Pa, and a partial pressure ratio of the acetylene to the carbon dioxide (acetylene/carbon dioxide) is in the range of 0.1 to 10.

Abstract: A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.

Abstract: By a silk fibroin porous material containing silk fibroin and an amino acid and a method for producing a silk fibroin porous material including freezing a fibroin solution having an amino acid added to a fibroin aqueous solution and subsequently thawing the solution to obtain a porous material, a porous material which does not contain a solvent and which is high in safety and a method for producing the same are provided.

Abstract: Provided is a friction material composition comprising: a binder; a fibrous base material; an abrasive material; an inorganic filler; and an organic filler, wherein the friction material composition further comprises: at least one selected from the group consisting of zinc, a cellulose fiber as the fibrous base materials and a flame retardant fiber as the fibrous base materials; an iron-based fiber as the fibrous base material in an specified amount; and an inorganic abrasive material having a Mohs hardness of 8 or higher and a particle size of 1 ?m or larger as the abrasive material in an amount of 1 wt % or less.

Abstract: Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.

Abstract: The method for producing carbon nanotubes employs a carbon source that contains carbon and is decomposed when heated and a catalyst on a support that serves as a catalyst for production of carbon nanotubes from the carbon source. The method includes a catalyst loading step in which the catalyst starting material is distributed over the support to load the catalyst onto the support, a synthesis step in which the carbon nanotubes are synthesized on the support, and a separating step in which a separating gas stream is distributed over the support to separate the carbon nanotubes from the support, wherein the catalyst loading step, the synthesis step and the separating step are carried out while keeping the support in a heated state and switching supply of the catalyst starting material, the carbon source and the separating gas stream.

Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.

Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.

Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.

Abstract: An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.