Patents Assigned to Hitachi Chemical DuPont Microsystems L.L.C.
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Patent number: 9209128Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.Type: GrantFiled: April 1, 2014Date of Patent: December 8, 2015Assignees: International Business Machines Corporation, HITACHI CHEMICAL DUPONT MICROSYSTEMS, L.L.C.Inventors: Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman
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Publication number: 20150279779Abstract: A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.Type: ApplicationFiled: April 1, 2014Publication date: October 1, 2015Applicants: Hitachi Chemical DuPont Microsystems, L.L.C., International Business Machines CorporationInventors: Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman
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Patent number: 8304149Abstract: A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.Type: GrantFiled: December 7, 2010Date of Patent: November 6, 2012Assignees: Hitachi Chemical Dupont Microsystems Ltd., Hitachi Chemical Dupont Microsystems L.L.C.Inventors: Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru, Takumi Ueno
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Patent number: 7851128Abstract: A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.Type: GrantFiled: November 29, 2006Date of Patent: December 14, 2010Assignees: Hitachi Chemical Dupont Microsystems Ltd., Hitachi Chemical Dupont Microsystems L.L.C.Inventors: Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru, Takumi Ueno
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Patent number: 6960420Abstract: A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1): (where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.Type: GrantFiled: November 6, 2003Date of Patent: November 1, 2005Assignees: Hitachi Chemical Dupont Microsystems LTD, Hitachi Chemical Dupont Microsystem L.L.C.Inventor: Hiroshi Komatsu
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Patent number: 6773866Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.Type: GrantFiled: December 12, 2001Date of Patent: August 10, 2004Assignees: Hitachi Chemical DuPont Microsystems L.L.C., Hitachi Chemical DuPont Microsystems Ltd.Inventors: Akihiro Sasaki, Noriyoshi Arai, Makoto Kaji, Toshiki Hagiwara, Brian C. Auman
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Patent number: 6600053Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern. wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.Type: GrantFiled: August 30, 2001Date of Patent: July 29, 2003Assignees: Hitachi Chemical DuPont Microsystems Ltd., Hitachi Chemical DuPont Microsystems L.L.C.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
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Patent number: 6514658Abstract: A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.Type: GrantFiled: March 30, 2001Date of Patent: February 4, 2003Assignees: Hitachi Chemical DuPont MicroSystems, Ltd., Hitachi Chemical DuPont MicroSystems, L.L.C.Inventors: Masataka Nunomura, Masayuki Ohe
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Publication number: 20020098444Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.Type: ApplicationFiled: December 12, 2001Publication date: July 25, 2002Applicant: Hitachi Chemical DuPont Microsystems L.L.C.Inventors: Akihiro Sasaki, Noriyoshi Arai, Makoto Kaji, Toshiki ` Hagiwara, Brian C. Auman
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Patent number: 6365306Abstract: Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.Type: GrantFiled: February 6, 2001Date of Patent: April 2, 2002Assignees: Hitachi Chemical DuPont Microsystems L.L.C., Hitachi Chemical Dupont Microsystems Ltd.Inventors: Masataka Nunomura, Noriyuki Yamazaki
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Patent number: 6342333Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.Type: GrantFiled: September 23, 1999Date of Patent: January 29, 2002Assignees: Hitachi Chemical DuPont Microsystems, L.L.C., Hitachi Chemical DuPont Microsystems, Ltd.Inventors: Akihiro Sasaki, Noriyoshi Arai, Makoto Kaji, Toshiki Hagiwara, Brian C. Auman
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Patent number: 6340546Abstract: Positive photosensitive resin compositions, which comprise (A) a polyamidate having repetitive units of general formula (I) wherein R1 is a tetravalent organic group, R2 is a divalent organic group having a phenolic hydroxyl group, three R3 groups and three R4 groups each independently are an alkyl group or a hydrogen atom, and at least two R3 groups and at least two R4 groups are alkyl groups, and (B) a compound capable of generating an acid when exposed to light, are improved in storage stability and exposure sensitivity to i-line. Such compositions can improve the reliability of electronic parts when formed into surface-protecting films or interlayer insulating films by a method including exposure to i-line, development and heating.Type: GrantFiled: February 9, 2000Date of Patent: January 22, 2002Assignees: Hitachi Chemical Dupont Microsystems Ltd., Hitachi Chemical Dupont Microsystems L.L.C.Inventor: Mamoru Sasaki
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Patent number: 6329494Abstract: A 6,6′-dialkyl-3,3′4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.Type: GrantFiled: November 1, 1999Date of Patent: December 11, 2001Assignees: Hitachi Chemical DuPont MicroSystems Ltd., Hitachi Chemical DuPont MicroSystems L.L.C.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
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Patent number: 6232032Abstract: Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.Type: GrantFiled: May 27, 1999Date of Patent: May 15, 2001Assignees: Hitachi Chemical DuPont Microsystems L.L.C., Hitachi Chemical DuPont Microsystems Ltd.Inventors: Masataka Nunomura, Noriyuki Yamazaki
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Patent number: 6146815Abstract: The invention provides a developer for photosensitive polyimides, with which polyimide patterning for interlayer insulating films for multi-layered circuit boards and for .alpha.-ray shield layers, buffer coat layers and others for semiconductor memory devices is attained within a shorter period of time than with conventional developers. It provides a developer for photosensitive polyimide precursors, which comprises two or more solvents including at least an aprotic polar solvent, and in which the mixed solution of the solvents has a polar component solubility parameter, .delta.P, of not smaller than 7, and provides a patterning method of using the developer.Type: GrantFiled: March 4, 1999Date of Patent: November 14, 2000Assignees: Hitachi Chemical DuPont Microsystems L.L.C., Hitachi Chemical DuPont Microsystems Ltd.Inventors: Hiroshi Komatsu, Takeharu Motobe