Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.
Type:
Grant
Filed:
December 13, 2013
Date of Patent:
July 28, 2020
Assignee:
Hitachi Chemical DuPont MicroSystems, Ltd.
Abstract: A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
Type:
Grant
Filed:
December 19, 2013
Date of Patent:
September 5, 2017
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule.
Type:
Grant
Filed:
June 13, 2012
Date of Patent:
March 1, 2016
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
Type:
Application
Filed:
December 19, 2013
Publication date:
December 10, 2015
Applicant:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.
Type:
Application
Filed:
December 13, 2013
Publication date:
November 26, 2015
Applicant:
Hitachi Chemical DuPont MicroSystems, Ltd.
Abstract: A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.
Type:
Grant
Filed:
January 18, 2011
Date of Patent:
September 15, 2015
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine.
Type:
Grant
Filed:
August 22, 2006
Date of Patent:
March 10, 2015
Assignee:
Hitachi Chemical Dupont Microsystems Ltd.
Abstract: A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.
Type:
Grant
Filed:
June 20, 2006
Date of Patent:
October 28, 2014
Assignee:
Hitachi Chemical DuPont Microsystems Ltd.
Abstract: A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and R1 and R2 each independently represents fluoroalkyl group having 1 to 3 carbon atoms.
Type:
Grant
Filed:
June 21, 2012
Date of Patent:
October 7, 2014
Assignee:
Hitachi Chemical Dupont Microsystems Ltd.
Abstract: The polyimide precursor composition of the present invention is characterized in comprising a polyimide precursor having a structure formed by reacting a diamine component (A) containing a fluorine-containing aromatic diamine (a1) represented by the following chemical formula (I) (in the formula (I), R1 and R2 are each independently selected from —H, —(CF2)n—CF3, and —O(CF2)n—CF3 (n is an integer of 0 or more and 7 or less), and at least one of R1 and R2 is a fluorine-containing group) and trans-1,4-cyclohexyldiamine (a2) with an acid dianhydride component (B) containing an aliphatic tetracarboxylic dianhydride (b1) and an aromatic tetracarboxylic dianhydride (b2). Use of the composition of the present invention provides a polyimide film and a transparent flexible film having high transparency, low thermal expansion properties, low birefringent properties, and high heat resistance.
Type:
Grant
Filed:
January 26, 2009
Date of Patent:
August 5, 2014
Assignee:
Hitachi Chemical DuPont Microsystems, Ltd.
Abstract: A resin composition includes: (A) a polymer having a structural unit shown by the formula (I), and an acidic functional group or a group derived therefrom at both of the terminals; wherein X1 is a di- to octa-valent organic group, Y1 is a di- to octa-valent organic group, R1 is a hydrogen atom or an organic group having 1 to 20 carbon atoms, R2 is a hydrogen atom or a monovalent organic group, when plural R1s or R2s exist, the plural R1s or R2s may be the same or different, p and q are independently an integer of 0 to 4, l and m are independently an integer of 0 to 2, and n is an integer of 2 or more indicating the number of structural units; (B) a solvent; and (C) a compound shown by formula (II) wherein R3 is a monovalent organic group.
Type:
Grant
Filed:
April 30, 2010
Date of Patent:
July 1, 2014
Assignee:
Hitachi Chemical DuPont Microsystems, Ltd.
Abstract: A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.
Type:
Grant
Filed:
January 13, 2011
Date of Patent:
June 24, 2014
Assignee:
Hitachi Chemical DuPont MicroSystems, Ltd.
Abstract: A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule.
Type:
Application
Filed:
June 13, 2012
Publication date:
May 1, 2014
Applicant:
Hitachi Chemical DuPont Microsystems, Ltd.
Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
Type:
Grant
Filed:
June 28, 2012
Date of Patent:
December 24, 2013
Assignee:
Hitachi Chemical Dupont Microsystems, Ltd.
Abstract: A photosensitive resin composition including: (a) a polyamide acid; (b) a compound (b1) having 4 or more of a methylol group, a methoxymethyl group and the both thereof, or a compound (b2) represented by the following formula (2); and (c) a photopolymerization initiator.
Type:
Application
Filed:
November 7, 2012
Publication date:
June 6, 2013
Applicant:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Inventor:
Hitachi Chemical DuPont MicroSystems, Ltd.
Abstract: Provided are a positive photosensitive resin composition that is developable in an alkaline aqueous solution and gives a good shaped pattern that is excellent in heat resistance and mechanical property, a method for producing the pattern and an electronic component. The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure represented by a general formula (3) crosslinkable or polymerizable with said component (a).
Type:
Grant
Filed:
October 29, 2008
Date of Patent:
April 16, 2013
Assignee:
Hitachi Chemical Dupont Microsystems, Ltd.
Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
Type:
Application
Filed:
June 28, 2012
Publication date:
December 27, 2012
Applicant:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.
Type:
Application
Filed:
January 18, 2011
Publication date:
November 15, 2012
Applicant:
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Abstract: A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
Type:
Grant
Filed:
December 7, 2010
Date of Patent:
November 6, 2012
Assignees:
Hitachi Chemical Dupont Microsystems Ltd., Hitachi Chemical Dupont Microsystems L.L.C.
Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
Type:
Grant
Filed:
April 13, 2010
Date of Patent:
November 6, 2012
Assignee:
Hitachi Chemical Dupont Microsystems, Ltd.