Patents Assigned to HITACHI CHEMICALS COMPANY, LTD.
  • Publication number: 20130340813
    Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).
    Type: Application
    Filed: January 11, 2012
    Publication date: December 26, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
  • Publication number: 20130340806
    Abstract: Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C.
    Type: Application
    Filed: January 11, 2012
    Publication date: December 26, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shinichirou Sukata, Hiroki Hayashi, Aya Momozaki
  • Publication number: 20130333744
    Abstract: Provided is a conductive adhesive composition including: conductive particles (A) containing metal having a melting point of equal to or lower than 210° C.; a resin (B) having a softening point of equal to or lower than the melting point of the metal of the conductive particles and being solid at a room temperature; a flux activator (C); and a solvent (D).
    Type: Application
    Filed: January 11, 2012
    Publication date: December 19, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Seigo Yokochi, Masaru Fujita, Hiroki Hayashi
  • Publication number: 20130328646
    Abstract: This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.
    Type: Application
    Filed: November 4, 2011
    Publication date: December 12, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuusuke Kondou, Etsuo Mizushima, Yasushi Watanabe, Yasuyuki Mizuno
  • Publication number: 20130330563
    Abstract: There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance.
    Type: Application
    Filed: January 17, 2012
    Publication date: December 12, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomohiko Kotake, Masato Miyatake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai
  • Patent number: 8604096
    Abstract: Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product. The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from ?-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: December 10, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouji Suzumura, Ikue Mitani, Toshihiko Takasaki, Ikuo Mukai, Masami Ochiai
  • Publication number: 20130319499
    Abstract: Provided is a conductive adhesive composition which contains conductive particles (A) containing metal having a melting point of equal to or lower than 210° C., a thermosetting resin (B), and a flux activator (C), in which viscosity of the conductive adhesive composition is 5 to 30 Pa·s, and a content of the conductive particles (A) is 70 to 90% by mass with respect to the total amount of the conductive adhesive composition.
    Type: Application
    Filed: September 30, 2011
    Publication date: December 5, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Seigo Yokochi, Hiroki Hayashi
  • Publication number: 20130318786
    Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.
    Type: Application
    Filed: August 9, 2013
    Publication date: December 5, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventor: Hidehiro NAKAMURA
  • Patent number: 8599470
    Abstract: A suspended particle device is realized which enables control of the amount of light transmitted through a prescribed area, without any complicated switching circuit on a substrate. A suspension, containing charged particles and a disperse medium, is filled between an A-substrate and a B-substrate, and first and second electrodes are formed on the A-substrate. A DC voltage is applied across the first and second electrodes, to localize the charged particles on the second electrode side. Subsequently, an AC voltage is applied across the first and second electrodes to orient, while maintaining the localized state of the charged particles, the charged particles along a direction of an electric field. Light transmittance is lower in an area where the charged particles are present than in an area without charged particles, whereas, in the area where the charged particles are present, the light transmittance can be controlled by adjusting the AC voltage.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: December 3, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shunsuke Mori, Yoshiro Mikami, Toshiaki Kusunoki
  • Patent number: 8592546
    Abstract: A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: November 26, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tooru Kikuchi, Toshihiko Takasaki, Katsuyuki Masuda
  • Patent number: 8592130
    Abstract: A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: November 26, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiro Miyasaka, Yukiko Muramatsu
  • Patent number: 8586698
    Abstract: The present invention relates to a production process for a phenols novolac resin obtained by reacting phenols with formaldehydes, wherein they are reacted in the presence of a metal compound used as a catalyst for the reaction described above, and a chelating agent is further added in order to deactivate a catalytic action of the metal compound and a resin-coated sand prepared by using the above phenols novolac resin. It is possible to provide a process for producing a phenols novolac resin having an ortho rate of 30 to 60%, suitably 40 to 55% at a good yield (70% or more) and a resin-coated sand having a high curing property prepared by using the above phenols novolac resin.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: November 19, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hiroyuki Kawata, Sadao Takashou, Tetsurou Saikawa
  • Patent number: 8586284
    Abstract: The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 19, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hanako Nankawa, Masahiro Miyasaka, Yukiko Muramatsu
  • Patent number: 8585272
    Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: November 19, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
  • Publication number: 20130302675
    Abstract: The invention provides a negative electrode material for lithium ion secondary battery, including a composite particle of a first particle containing a carbonic substance A and a second particle containing silicon, which are combined with a carbonic substance B, wherein, when a cross-section of the composite particle is observed with respect to: the content of silicon atom in a core region in a circle having a center thereof on the midpoint of the major axis, which constitutes the maximum length, and having a radius of ? of the length of the minor axis orthogonally intersecting the major axis at the midpoint thereof, and the content thereof in a rim region extending from the circumference to a depth of ? of the length of the minor axis, the ratio of the content in the rim region to that in the core region is 2 or higher.
    Type: Application
    Filed: December 9, 2011
    Publication date: November 14, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masayuki Kouzu, Kento Hoshi, Toshikatsu Shimazaki
  • Publication number: 20130302603
    Abstract: The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or more.
    Type: Application
    Filed: January 24, 2012
    Publication date: November 14, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kaoru Konno, Hiroki Hayashi, Michiko Natori
  • Publication number: 20130300954
    Abstract: The adhesive sheet for an image display device includes a structural unit derived from the following general formula (a), wherein the glass transition temperature is from 10 to 50° C., and tan ? at 40 to 80° C. is from 0.5 to 1.1, The adhesive sheet for an image display device, an image display device, and an adhesive resin composition for an image display can be provided, which are useful for the prevention of cracking, the attenuation of the stress and the impact, that have excellent transparency, which improve the fog and the flicker in an image displayed on the screen, and which reduce the bubbles, the sullage, and the detachment, particularly under high temperature condition (for example, 80° C. or more) or under high-temperature and humidity condition (for example, 85° C./85% RH). In the formula, X is a hydrogen atom or a methyl group.
    Type: Application
    Filed: December 9, 2011
    Publication date: November 14, 2013
    Applicant: Hitachi Chemical Company, LTD
    Inventors: Seiji Sunohara, Junichi Imaizumi, Tomoyuki Nakamura, Hajime Nakamura, Kouji Yamazaki, Hiroaki Takahashi, Kazuhiro Makishima, Kenichi Shinya, Megumi Tomomatsu
  • Patent number: 8580437
    Abstract: A method for forming a negative electrode for a lithium secondary battery, includes providing a paste comprising graphite particulates comprise assembled or bound graphite particles in each of which a plurality of flat-shaped particles are assembled or bound together so that the planes of orientation are not parallel to one another, and the mixture including 3 to 10 parts by weight of the organic binder per 100 parts by weight of the graphite particulates, a binder and a solvent, coating the paste on a current collector, drying the paste coated on the current collector to form a mixture of the graphite particulates and the binder, and integrating the mixture with the current collector by pressing to provide a density of the mixture of graphite particulates and organic binder of 1.5 to 1.9 g/cm3.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: November 12, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshito Ishii, Tatsuya Nishida, Atsushi Fujita, Kazuo Yamada
  • Publication number: 20130286604
    Abstract: A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. Namely, a photocurable resin composition comprises a compound (A) having a photopolymerizable functional group and an oil gelling agent (B), is provided. Also, an image display device having a laminate structure including an image display unit having an image display part, a transparent protective plate, and a resin layer existent between the image display unit and the transparent protective plate, wherein the resin layer is a cured material of the above-described photocurable resin composition, is provided.
    Type: Application
    Filed: March 21, 2013
    Publication date: October 31, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Hitachi Chemical Company, Ltd.
  • Patent number: D692578
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: October 29, 2013
    Assignees: Hitachi Chemical Company, Ltd., National University Corporation Tokyo University of Agriculture and Technology
    Inventors: Yoshihito Kikuhara, Masafumi Kanetomo, Masahito Hosokawa, Tomoko Yoshino, Tadashi Matsunaga