Patents Assigned to Hitachi Device Engineering Corp
  • Semiconductor device and display unit using the semiconductor device and notebook-size personal computer
    Patent number: 5767571
    Abstract: To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.
    Type: Grant
    Filed: June 13, 1996
    Date of Patent: June 16, 1998
    Assignees: Hitachi, Ltd, Hitachi Device Engineering Corp
    Inventors: Makoto Kimura, Shinji Tojo, Takahiro Fujioka, Akihiko Narisawa, Yoshiyuki Tanigawa, Shinya Kanamitsu, Koji Akimoto, Hiroyuki Mouri