Abstract: A microscopic change in a luminous intensity occurring near an etching endpoint is accurately detected, whereby the endpoint of etching is quickly determined. An etching endpoint determination method for determining an endpoint of etching processing in a plasma etching apparatus that introduces a processing gas into a vacuum chamber, produces plasma by feeding high-frequency energy to a introduced processing gas, and uses the produced plasma to perform plasma processing on a workpiece stored in the chamber includes: a step of sampling light of a pre-set wavelength from light emitted by the plasma produced in the vacuum chamber, acquiring as time-sequential data the luminous intensity of the sampled light of the specific wavelength, and computing a regression line on the basis of the acquired time-sequential data; and a step of computing distances in a time-base direction between the regression line and the time-sequential data which are obtained at the first step.

Abstract: The invention provides a plasma processing apparatus for measuring the etching quantity of the material being processed and detecting the end point of etching using optical interference on the surface of a sample being processed, so as to simultaneously realize long life and ensure sufficient light to be received via a light transmitting unit, to enable long term stable operation and to improve the processing accuracy via accurate etching quantity detection.

Abstract: This invention relates to a work edge detection mechanism that enables an edge of a work to be viewed clearly through an aligning camera without adding an illumination device, and to a work transfer mechanism that uses the work edge detection mechanism. The work edge detection mechanism formed from a tubular body provided with an opening at one end thereof, the tubular body having a blocking member provided at the other end thereof, includes light-reflecting means on a lower surface side of the blocking member in order to reflect any light entering from the opening, is constructed so that the tubular body has an inside diameter (?1) at the opening of the tubular body and an inside diameter (?2) at a side of the blocking member, the inside diameter (?2) being greater than the inside diameter (?1), and enables vacuum suction transfer of the work.

Abstract: An electron capture dissociation device to implement a combination of electron capture dissociation and collision dissociation and a mass spectrometer with the use thereof are provided. This device includes a linear ion trap provided with linear multipole electrodes applied with a radio frequency electric field and wall electrodes that are arranged on both ends in the axis direction of the linear multipole electrodes, have holes on the central axis thereof, and generate a wall electric field by being applied with a direct-current voltage, a cylindrical magnetic field-generating unit that generates a magnetic field parallel to the central axis of the linear multipole electrodes and surrounds the linear ion trap, and an electron source arranged opposite to the linear multipole electrodes with sandwiching one of the wall electrodes. The electron generation site of the electron source is placed in the inside of the magnetic field generated by the magnetic field-generating unit.

Abstract: An object of the present invention is to provide a scanning electron microscope suitable for monitoring apparatus conditions of the microscope itself, irrespective of the presence of charge-up, specimen inclination, and the like. In order to achieve the object, proposed is a scanning electron microscope including a function to monitor the apparatus conditions on the basis of information obtained with an electron beam reflected before reaching a specimen. Specifically, for example, while applying a negative voltage to the specimen to reflect the electron beam before the electron beam reaches the specimen, and simultaneously supplying a predetermined signal to a deflector for alignment, the scanning electron microscope monitors changes of the detected positions of the reflected electrons of the electron beam. If the above-mentioned predetermined signal is under the condition where an alignment is properly performed, the changes of the detected positions of the electrons reflect deviation of an axis.

Abstract: A liquid chromatograph apparatus capable of eliminating a deviation of measurement results originating from an instrumental error is provided. According to the present invention, a mobile phase arrival time T of the liquid chromatograph apparatus is determined in advance. The mobile phase arrival time T is a time taken for a mobile phase mixed by a pump to reach a detector. When operating the liquid chromatograph apparatus, sample injection into the mobile phase is started after a time corresponding to the mobile phase arrival time T passes. Collection of data output from the detector is started after a predetermined time passes after starting the sample injection into the mobile phase.

Abstract: It is an object of the present invention to provide an electron microscope for properly applying a retarding voltage to a sample which is brought into electrical conduction.

Abstract: Provided is a sample observing method wherein the effect on throughput is minimized, and a pattern profile can be obtained at high accuracy even in a complicated LSI pattern, regardless of the scanning direction of an electron beam. In the sample observing method, the presence or absence of an edge parallel to a scanning direction (707) of an electron beam is judged regarding an edge (708) of a pattern to be observed (S702); if the edge is present, an area in the vicinity of the pattern edge is designated as a local pre-dose area (709) (S703); a local pre-dose of an electron beam is performed, so that the initial charged state is controlled not to return secondary electrons generated by irradiation of an electron beam when an image is captured, to the surface of a sample.

Abstract: A high speed defect inspection apparatus has a high-speed detector that includes a plurality of image sensors. The image sensors are arranged with gaps between them in the pixel direction to form two lines. The image sensors are arranged in a zigzag pattern so that they are not contiguous to each other in the scanning direction. The development cost is reduced by using an arrangement of a plurality of small-area image sensors. When an image sensor is installed, it is necessary to furnish a region required for installation. Since individual image sensors need to be arranged at fixed intervals, void regions result. A plurality of image sensors are arranged in a zigzag pattern to solve the void region problem.

Abstract: A plasma processing apparatus includes: a decompression chamber of which the inside is depressed; a gas supply unit that supplies process gas into said chamber; a microwave supply unit that supplies a microwave into the chamber to generate plasma; an object-placing electrode where a processing material, is placed and which holds the processing material in the chamber; and a vacuuming unit that is connected to the chamber to discharge the gas in the chamber, in which the chamber, a part for providing gas into the chamber of the gas supply unit, a part for introducing a microwave into the chamber of the microwave supply unit, the object-placing electrode, and the vacuuming unit are disposed coaxially with the center axis of the chamber, and the part for introducing a microwave includes a microwave rotation generator that rotates a polarization plane of the input microwave and supplies the microwave to the chamber.

Abstract: An automatic multi-purpose analyzer performs qualitative and quantitative analysis of biological samples such as blood, urine, etc. and includes a plurality of analysis units connected in series through a transfer line for transferring the sample, wherein failure caused by incorrect surface detection is resolved. The plurality of analysis units are connected in series through a transfer line for transferring a sample, each analysis unit including a pipetting mechanism for pipetting the sample, and wherein each of the analysis units includes a transmission mechanism for transmitting information about the amount of sample, obtained upon sample pipetting by the pipetting mechanism of each analysis unit, to other analysis units.

Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.

Abstract: A specimen stage apparatus has a braking structure which can generate a braking force enough to stop a specimen stage while keeping a movable table from increasing in its weight. The specimen stage apparatus has an X guide fixed on an X base and representing a guide structure in X direction, an X table constrained by the X guide to be movable in X direction, an X actuator having its movable part fixed to the X table and an X brake fixed to the X base and representing a braking structure for the X table. A controller carries out positioning control in which it generates a braking force by pushing the X brake against the bottom surface of the X table to stop a specimen stage and turning off the servo-control of the X actuator after stoppage of the specimen stage.

Abstract: Stepped portions of a flow channel are reduced by completely fixing the channel that extends to the measuring unit, and reducing connections in the channel, thereby to suppress a disturbance in the flow of the liquid suctioned into the measuring unit. A means is provided so that the reaction solution and reagent suctioned will move towards the channel through which the liquids are suctioned.

Abstract: Abnormality causes are automatically identified during daily quality control, based on the focused consideration of complex uncertainty factors and, especially, of the causes of device-side abnormalities (i.e., abnormalities of the optical system and the dispenser mechanism), the latter of which are often difficult to identify. The analyzer performance that affects measurement results can be estimated from analysis parameters and calibration results. Thus, uncertainty estimates are automatically calculated for each analysis item during quality control, and the estimates are compared with uncertainties obtained during actual QC sample measurement, thereby monitoring and evaluating the analyzer performance. Also, measurements are performed on QC samples of multiple concentrations that contain substances known to subject to particular influences such as those of the optical system, sample dispenser, and reagent dispenser, so that the causes of abnormalities can be identified.

Abstract: The invention provides a plasma processing apparatus and a dry etching method for etching a multilayered film structure having steps with high accuracy. The plasma processing apparatus comprises a vacuum reactor 107, a lower electrode 113 placed within a processing chamber of the vacuum reactor and having a wafer 112 to be etched mounted on the upper surface thereof, bias supplying units 118 and 120 for supplying high frequency power for forming a bias potential to the lower electrode 113, a gas supply means 111 for feeding reactive gas into the processing chamber, an electric field supplying means 101 through 103 for supplying a magnetic field for generating plasma in the processing chamber, and a control unit 127 for controlling the distribution of ion energy in the plasma being incident on the wafer 112 via the high frequency power.

Abstract: The present invention provides a nucleic acid analyzing apparatus which achieves highly accurate analytical ability even in single molecule DNA analysis. The nucleic acid analyzing apparatus detects locations of fluorescent bright spots in image information about light emission, deletes defective bright spots, and thereby creates intensity trace data about proper bright spots.

Abstract: For adjusting a positional relationship between a specimen and a probe to measure an electric characteristic of the specimen through a contact therebetween, a base table holding a specimen table holding the specimen and a probe holder holding the probe is positioned at a first position to measure the positional relationship between the probe and the specimen at the first position, and subsequently positioned at a second position to measure the positional relationship therebetween at the second position so that the probe and the specimen are contact each other at the second position, the specimen table and the probe holder are movable with respect to each other on the base table at each of the first and second positions to adjust the positional relationship between the probe and the specimen, and a measuring accuracy at the second position is superior to a measuring accuracy at the first position.

Abstract: This invention relates to a SEM system constructed to create imaging recipes or/and measuring recipes automatically and at high speed, and improve inspection efficiency and an automation ratio, and to a method using the SEM system; a method for creation of imaging recipes and measuring recipes in the SEM system is adapted to include, in a recipe arithmetic unit, the steps of evaluating a tolerance for an imaging position error level at an evaluation point, evaluating a value predicted of the imaging position error level at the evaluation point when any region on circuit pattern design data is defined as an addressing point, and determining an imaging recipe and a measuring recipe on the basis of a relationship between the tolerance for the imaging position error level at the evaluation point and the predicted value of the imaging position error level at the evaluation point.

Abstract: A sample measuring method and a charged particle beam apparatus are provided which remove contaminants, that have adhered to a sample in a sample chamber of an electron microscope, to eliminate adverse effects on the subsequent manufacturing processes. To achieve this objective, after the sample measurement or inspection is made by using a charged particle beam, contaminants on the sample are removed before the next semiconductor manufacturing process. This allows the contaminants adhering to the sample in the sample chamber to be removed and therefore failures or defects that may occur in a semiconductor fabrication process following the measurement and inspection can be minimized.